Scientists at Stanford University have released new findings that demonstrate the benefits of using carbon nanotube arrays at critical junctions between two materials to help better relieve thermal stress. Thermal stress, often caused by the joining of two materials that expand and contract at different rates as temperatures change, can lead to unnecessary strain and … [Read more...]
Boron Nitride Filler for Thermally Conductive Dielectric Plastic Compounds
Saint-Gobain Ceramic Materials has released its new CarboTherm boron nitride thermal management fillers for use in thermally conductive, dielectric plastic compounds. The new boron nitride fillers will be on display December 10-11 at the Compounding World Forum 2013 in Philadelphia, Penn., USA. “Boron nitride, unlike other ceramics, is soft and non-abrading, enabling longer … [Read more...]
New Dispensable Thermal Pads Offer Improved Heat Management, Greater Application Potential
Dow Corning, a developer of silicon-based technology, has introduced new Dow Corning Dispensable Thermal Pads for use in LED, data server, telecommunications equipment and transportation thermal management applications. “Compared to traditional fabricated thermal pads, new Dow Corning Dispensable Thermal Pads offer the potential for broader design latitudes, simplified … [Read more...]
Thermoelectric Coolers for High Temperature Environments
Thermoelectric air conditioner supplier EIC Solutions has expanded its line of ThermoTEC thermoelectric coolers with the addition of a high ambient temperature model. Designed to cool electronic enclosures in extremely hot settings such as in deserts, or in high heat industrial applications such as those near blast furnaces, the new thermoelectric units are capable of … [Read more...]
Technique Combines Heat Sinks for More Effective Cooling
Researchers at the National University of Singapore have developed a new two-phase technique they say is up to 50 percent more effective in cooling electronic systems compared to current cooling technology. Led by Lee Poh Seng, Ph.D., of the Department of Mechanical Engineering at NUS, the team combined microgap and stepped fin microchannel heat sinks to create a two-phase … [Read more...]
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