Murata Electronics North America added the ±0.5% tolerance option to its NCP series negative temperature coefficient (NTC) thermistor line. The ultra-tight tolerance thermistor is offered for consumer, industrial and automotive temperature ranges (-40°C to +150°C), and provides a low-cost alternative to integrated circuit (IC) based sensing solutions when high sensing accuracy … [Read more...]
Thermal circuit breaker with rotary knob actuator
Schurter’s TA35 thermal circuit breaker series now offers a rotary style actuator. In addition to the classic rocker style, the grip and turn style knob is well-suited for applications where a longer feedback is desired, such as those where gloves are used. The new TA35 rotary switch offer IP 40 protection. The switch and thermal overload protection with positively trip-free … [Read more...]
Health Assessment and Prognostics of Electronic Products: An Alternative to Traditional Reliability Prediction Methods
Introduction Traditional handbook-based reliability prediction methods for electronic products include Mil-Hdbk-217, Telcordia SR-332 (formerly Bellcore), PRISM, FIDES, CNET/RDF (European), and the Chinese GJB-299. These methods rely on analysis of failure data collected from the field and assume that the components of a system have inherent constant failure rates that are … [Read more...]
LED Thermal Standardization: A Hot Topic
Introduction The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and LED-based products (see Fig.1 showing a typical LED package). The LED-business is growing much faster than analysts predicted five years ago. Unfortunately, the progress in thermal characterization has not kept … [Read more...]
Numerical Simulation of Complex Submicron Devices
Introduction Significant increases in temperature are believed to contribute to losses in reliability and performance, and can present serious complications to thermal management. The net thermal effect depends on a combination of factors related to the feature size, power densities, and material properties. In semiconductor devices, higher heat flux densities can result from … [Read more...]
