A tiny solid-state refrigerator that employs quantum physics in micro- and nanostructures to cool larger objects to extremely low temperatures has been demonstrated by researchers at the National Institute of Standards and Technology (NIST). According to the researchers, the device’s cooling power is equivalent to that of a window-mounted air conditioner successfully cooling a … [Read more...]
Advanced Circuitry Option for Thermoelectric Cooling Unit Enables Maximum Cooling Output “Regardless of Available Power Supply or Integrity of Voltage Flow”
EIC Solutions, Inc., a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has announced the availability of an advanced circuitry engineering option for the company’s thermoelectric cooling units that enables “maximum cooling output regardless of available power supplies or the integrity of the voltage flow.” The new advanced circuitry … [Read more...]
Laird Technologies Acquires Thermoelectric Technology Developer Nextreme Thermal Solutions
Laird Technologies, a developer of components and solutions for electromagnetic interference protection and thermal protection of electronics, has announced the acquisition of U.S.-based manufacturer of thin-film thermoelectric technologies Nextreme Thermal Solutions. Though Nextreme and Laird currently have a strategic design and distribution partnership, the acquisition will … [Read more...]
Researchers Enhance Thermoelectric Device Efficiency with Embedded Nanoparticles
Researchers at the Massachusetts Institute of Technology (MIT) and Rutgers University have developed a new method of enhancing the efficiency of thermoelectric devices using embedded nanoparticles, structures created by embedding one material into another. The new method may have the potential to widen the use of thermoelectric devices. In cooperation with graduate student … [Read more...]
3200 BTU Thermoelectric Air Conditioner
EIC Solutions has introduced a 3,200 BTU thermoelectric air conditioner. The new air conditioner employs 50 percent more thermoelectric chips (TECs) with a minimal change in the overall dimensions of the unit. The footprint is identical to the 2,500 BTU model allowing for simple changeovers to achieve increased cooling capacity in existing applications or minimal design changes … [Read more...]
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