Researchers at the Massachusetts Institute of Technology (MIT) and Rutgers University have developed a new method of enhancing the efficiency of thermoelectric devices using embedded nanoparticles, structures created by embedding one material into another. The new method may have the potential to widen the use of thermoelectric devices. In cooperation with graduate student … [Read more...]
3200 BTU Thermoelectric Air Conditioner
EIC Solutions has introduced a 3,200 BTU thermoelectric air conditioner. The new air conditioner employs 50 percent more thermoelectric chips (TECs) with a minimal change in the overall dimensions of the unit. The footprint is identical to the 2,500 BTU model allowing for simple changeovers to achieve increased cooling capacity in existing applications or minimal design changes … [Read more...]
Research Program Attempts Embedded Cooling
DARPA’s Intrachip/Interchip Enhanced Cooling (ICECool) program seeks to explore embedded thermal management by bringing microfluidic cooling inside the substrate, chip or package by including thermal management in the earliest stages of electronics design. This embedded cooling comes in the form of microchannels designed and built directly into chips, substrates and packages. … [Read more...]
New Panel Coolers Decrease Noise Level
Nex Flow™ Air Products introduces a simple and inexpensive solution to heat related problems in Industrial Control Enclosures while addressing the increasing concern about noise levels in the work environment. Silent X-Stream ™ Frigid –X™ Panel Coolers are now available with electronic control to conserve compressed air and set the desired temperature in the control … [Read more...]
Thin-film TEC Improves Cooling Performance
Nextreme Thermal Solutions announced the availability of new thin-film thermoelectric cooling products that offer 55°C of cooling performance at an ambient temperature of 25°C. This new level of performance translates to improved cooling efficiency, lower input power requirements, and greater opportunities for solving thermal issues in electronics, photonics and avionic … [Read more...]
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