Gates Corporation, a global manufacturer of innovative, highly engineered power transmission and fluid power solutions, has launched Data Master™ Eco. This next-generation liquid cooling solution is designed to support hyperscale data centers and high-performance computing (HPC) conditions to maximize uptime, reduce environmental impact and meet the complex AI-enabling, data … [Read more...]
Alloy Enterprises Extends Direct Liquid Cooling Across the Blade, Eliminating the 100 kW Peripheral Heat Bottleneck
Boston, MA – November 5, 2025 – Alloy Enterprises today announced a breakthrough in data center cooling: single-piece, leak-tight cold plates that extend direct liquid cooling (DLC) across the blade, including DIMMs, NICs, and QSFPs. Built using the company’s patented Stack Forging™ process, the new design enables full-blade liquid cooling for the first time, eliminating the … [Read more...]
Sheetak Strengthens U.S. Thermoelectric Manufacturing with Custom Solutions and Rapid Prototyping
Custom thermoelectric devices, faster prototypes, and reliable U.S. manufacturing for critical industries. Sheetak Inc., a U.S.-based leader in advanced thermoelectrics, is redefining solid-state cooling and energy management with fully customizable devices and rapid prototyping through its expanded U.S. manufacturing capabilities. Headquartered in Austin, Texas, Sheetak … [Read more...]
Rosenberg Introduces New 170W Ecofit EC Fans: More Cooling Power and Efficiency for Your Application
Rosenberg's new generation of Ecofit G9 EC motors offers an increased power rating of 170 watts, providing a higher-performance, more energy-efficient air movement solution. The new motor is available on 48 models of Ecofit backward-curved fans and forward-curved blowers. They provide improved ventilation without impacting the budget or increasing the energy footprint. Another … [Read more...]
Alloy Enterprises Unveils Copper Direct Liquid Cooling, Slashing AI Data Center Energy Use and Eliminating the Need for HVAC
Alloy Enterprises, a manufacturing company revolutionizing data center cooling with its novel Stack Forging™ process, today introduced a new copper direct liquid cooling (DLC) solution. As chip power densities and thermal design power rise—pushing AI server rack power densities beyond 120 kW—traditional cooling methods are reaching their limits. With Stack Forging, Alloy … [Read more...]
