Data center airflow management solutions provider Upsite Technologies is now offering EnergyLok Cooling Capacity Assessment, a new service designed to help data center operators assess their cooling infrastructure and identify savings opportunities that could be realized through applying new airflow management practices. According to the company, the vendor-neutral service … [Read more...]
New PMIC Reduces Thermal Stress in Processors
High performance analog IC and sensor provider ams AG has introduced the AS3721, a power management IC (PMIC) with an innovative remote-feedback circuit designed to help reduce the thermal stress of applications processors in smartphones and tablets. When paired with ams’ new AS3729 point-of-load regulators, AS3721 provides a complete power management system that offers a fast … [Read more...]
Material Solutions for High-Frequency, High-Thermal-Reliability and Multilayer Circuits
Rogers Corporation, a manufacturer of specialty materials and components that enable high performance and reliability of consumer electronics, power electronics and telecommunications infrastructure, will be featuring its new high-Dk RO4360G2 laminate and 2929 bondply materials at the PCB West 2013 conference and exhibition Sept. 25, 2013 in Santa Clara, Calif. According to … [Read more...]
New Thermoelectric Peltier Cooler
Temperature control specialist Oven Industries Inc. has released a new line of thermoelectric peltier coolers for use in a variety of temperature control applications. Ideal for usage in universities, science laboratories, PCR research and businesses that specialize in temperature control, the 5R6-900 peltier cooler features an easy-to-read digital display for controlling … [Read more...]
New Low Resistance TIM Delivers 6.0 W/m°K Thermal Conductivity
Thermal interface material provider Fujipoly has released Sarcon GR45A-00, a very low modulus thermal interface material with a low thermal resistance. Featuring a thermal conductivity of 6.0 W/m°K per ASTM D2326 (4.5 W/m°K per ISO/CD 22007-2 Hot disk) and a thermal resistance as low as 1.33°C cm2/W, the new formulation completely fills air gaps between components, board … [Read more...]
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