Infineon Technologies AG and Henkel Electronic Materials have collaborated to release a new type of heat-conducting paste “optimized” for thermal management of power semiconductors. According to the two companies, the new compound allows a higher power density for the same ageing resistance. According to Dr. Martin Schulz of Infineon Technologies AG, “[LOCTITE TCP 7000] … [Read more...]
Thermal Imaging Camera Kit Offers Less Than 50mK Sensitivity
Omega Engineering Inc., a manufacturer of measurement and control instruments for a range of applications, has released thermal imaging camera kit model OSXL-A35SC for thermal benchtop testing applications. According to the company, the new thermal imaging camera kit features “plug-and-play” compatibility, fast data transfer, a wide temperature range and less than 50mK … [Read more...]
New High Bay LED Cooler Is Smaller and Lighter Than Passive Cooling Equivalents
Nuventix, Inc. has introduced the LED Cooler R150-170, a new high bay LED cooler that, according to the company, is “33 percent smaller and 60 percent lighter than passive cooling equivalents used in industrial high bay fixtures.” The announcement was made at the Strategies in Light show held on February 12-14 in in Santa Clara, Calif. The R150-170 is capable of “exceptional … [Read more...]
Thermal Gap Fillers Feature High Performance, Low Contact Resistance
Laird Technologies, Inc., a designer of customized performance-critical components and systems for advanced electronics and wireless products, has announced the release of Tflex SF800 and Tflex SF200, two new Tflex series thermal gap fillers. According to the company, “Tflex SF800 is a high performance gap pad with exceptional wetting characteristic, while Tflex SF200 features … [Read more...]
Adaptable Concurrent CFD Simulation Software Provides Ease-of-Use
Mentor Graphics Corporation has announced the newest version of the FloEFD concurrent computational fluid dynamics (CFD) simulation software. According to the company, the new software version provides a “significant workflow process improvement, including automated geometry clean-up … [and] the ability to mesh complex models.” The software also includes parametric “study and … [Read more...]
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