Mentor Graphics, a developer of electronic hardware and software design solutions, has announced FloTHERM XT, an electronics cooling simulation software package that enables “earlier virtual prototyping, fewer design iterations and advanced ‘what if’ analysis for improved product quality and faster time-to-market benefits.” According to Mentor Graphics, the new software is … [Read more...]
Heat Transfer at 'Any Temperature' Makes Thermal Interface Film Suitable for Cold Plate Applications
Thermal interface material developer AOS Thermal Compounds recently released Micro-Faze, a thermal interface film formulated with non-silicon thermal grease. According to AOS Thermal Compounds, Micro-Faze “requires minimum force to achieve total interface contact” and “Retains all the performance advantages of thermal grease . . . in the form of a thermal pad.” Suited for cold … [Read more...]
Low-Viscosity Thermally Conductive Silicone Compound
Fujipoly introduces its SARCON SPG-20A, a low-viscosity thermally conductive silicone compound. When applied between a heat-generating component and a nearby heat sink or spreader, the very low compression, form-in-place material fills gaps up to .50 mm in height. According to the company, "The form stable thermal compound requires no heat curing, will not cause corrosion on … [Read more...]
General Purpose Thermoreflectance Analyzer Released
Microsanj announces a new product to premiere at SEMI-THERM. The latest addition to the Thermoreflectance Thermal Imaging product line is the NT100A General Purpose Thermoreflectance Analyzer. The analyzers include the NT100: General Purpose; NT200/210: 100nsec, submicron transient; NT300/310: Through-the-substrate (flip mount); and NT410: 800psec high performace. Visit … [Read more...]
Modular Cooling System Designed for Rapid Deployment with Containerized Data Centers
STULZ Air Technology Systems, Inc., a provider of cooling solutions and services for mission critical applications, has released the STULZ CyberCon modular outdoor cooling system designed for fast deployment with containerized computer rooms (PODs). According to the company, the new cooling system’s modular design “reduces up-front capital costs and adapts to rapidly changing … [Read more...]
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