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Investigating New Methods for Removing Heat from 3-D Integrated Circuitry

 

Franklin Robinson, a NASA Thermal Engineer, and his team are studying different cooling techniques so that NASA might benefit from future integrated circuitry. “To make sure NASA benefits from this emerging 3-D-circuit technology, Robinson and his team have begun investigating a technology that would remove heat by flowing a coolant through embedded channels about the size of … [Read more...]

Scientists Investigate New Metal Alloy System

 

A new study published in Scientific Reports by scientists at Rochester Institute of Technology investigates a metal alloy system that could lead to commercially viable magnetic refrigerants and environmentally friendly cooling technologies. "The materials use magnetic fields to change a refrigerant's temperature without the coolant gases associated with global warming. The … [Read more...]

Thermoplastically Deformable Electronic Circuits to Improve LEDs

 

This week, at the Meeting of the International Microelectronics Assembly and Packaging Society (IMAPS 2015), CMST and imec (a lab at Ghent University) will present a new thermoplastically deformable electronic circuit. This circuit enables low cost 2.5D free-form rigid electronic objects. These circuits are currently being tested to determine its potential to improve LED … [Read more...]

Electron Chirality in Graphene Impacts Current Flow

 

A group of researchers from Russia and the U.K. have discovered that electron chirality in graphene impacts current flow. The team’s paper, which was published in the journal Nature Physics, explains how the group detected and measured the impact of chirality in graphene. The researchers suggests that this discovery could lead to better tunneling electronic devices and new … [Read more...]

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