Introduction Temperature control of microelectronic devices has become more important in recent years. Device miniaturization and higher switching speeds have increased power dissipation substantially. Limiting the maximum die temperature has resulted in an increase of packaging complexity and cost. The failure rates resulting from electromigration and oxide breakdown are … [Read more...]
Exploring the Limits of Air Cooling
Introduction Heat from electronic devices is an integral part of information processing, not a nuisance that can someday be eliminated. This is a physical principle that is independent of the device of information processing. However, when viewed in the historical perspective, the severity of heat problems has not monotonically increased. It came to the fore some time ago, … [Read more...]
Direct Die Attach Using a Room Temperature Soldering Process
As the power and power density of IC components continue to rise [1], the need to effectively dissipate the heat to ensure long-term reliability has increased [2]. The largest contributor to the total thermal resistance along the heat conduction path comes from the thermal interface material (TIM) used between the surfaces of the silicon die and the heat spreader or heat sink. … [Read more...]
On-Chip Electrowetting Cooling
Introduction Control of component temperatures and temperature gradients is essential for the successful operation and reliability of electronics products [1]. However, conventional cooling methods, such as natural convection or fan-induced air-cooling, cannot cope with the increasing demand for electronics cooling. Therefore, more sophisticated cooling techniques are required. … [Read more...]
Thermal Conductivity of Doped, Porous and Isotopically Pure Silicon
Earlier issues of ElectronicsCooling showed the thermal conductivity for pure Si (May '98), SiO2 (Aug '04) and III-V semiconductors (Feb '06). This column focuses on doped Si, porous Si and isotopically pure Si. Table 1. Thermal Conductivity Data at Room Temperature The first seven rows of Table 1 show thermal conductivity data for natural and isotopically pure Si as … [Read more...]
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