Warpage of FC-PBGA Packages Flip chip technology has emerged as an important chip-level package solution to meet the ever-increasing demand of high I/O requirements. The flip chip technology was implemented originally for a multi-layer ceramic substrate. In the ceramic flip chip package, a shear strain in each bump, produced by the mismatch of the coefficient of thermal … [Read more...]
Electroosmotic Microchannel Cooling System for Microprocessors
Computer heat sinks, such as fin arrays and heat pipes, are much larger than silicon chips and are continuing to grow in size. This trend is driven by the increasing chip heat generation rates and has serious implications for overall system performance. The large volume of existing heat sinks causes discrete memory, video, and power-delivery components to be crowded away from … [Read more...]
Numerical Modeling and Experimental Verification of High-density Servers
High-density hardware and software are developed as part of an initiative to greatly increase data center compute densities. Concept systems presented here are based on the Intel® Itanium™ processor family and are designed for a 1U rack-mount form factor. The current dual-processor system concept is targeted at the front-end server market (e.g., web hosting and mail routing), … [Read more...]
Thermal Calculations for Multi-chip Modules
Due to the flexible manufacturing processes for producing BGA packages, there has been an explosion of new package designs, many of which contain more than one integrated circuit chip [1]. Existing industry standards for IC package thermal characterization apply only to single-chip packages. This Calculation Corner will present some techniques for calculating the junction … [Read more...]
There's something for everybody on talk radio
I was doing my Sunday morning (2 a.m.) radio call-in show about electronics cooling (Hot Air on the Air with Tony K), when I heard a familiar voice on the line. "Herbie in Hereford," I greeted the caller, "You're on the air with Hot Air." "First time caller, long time listener . . .," the caller said. "Wow. There must be an insomnia epidemic," I interrupted. Johnny, the … [Read more...]
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