Laird Technologies, a manufacturer of performance-critical components and systems for advanced electronics and wireless products, has recently released the WL Series Liquid to Heat Exchanger Systems product line for use in demanding thermal management applications on the market. According to the company, the WL Series are designed to remove large amounts of heat from densely … [Read more...]
CPU Cooler for Compact Environment
Thermal solutions developer Phanteks has released the PH-TC90LS, an ultra-low profile thermal radiator for CPU cooling in a compact environment. The PH-TC90LS heat sink measures 27mm tall—34mm when the bundled fan is attached—and is compatible with small form factor cases with a 45mm clearance. The fan is equipped with a pulse-width modulation (PWM) controller and can generate … [Read more...]
Company Awarded Patents for Thermal Management in Semiconductor Applications
Sp3 Diamond Technologies, Inc., a developer of CVD hot filament diamond deposition reactors and diamond-based solutions for electronics thermal management, has been awarded two patents by the United States Patent and Trademark Office for its DiaMatch™ coefficient of thermal expansion (CTE) matched heat spreader technology. DiaMatch™ is a diamond-based multilayered structure … [Read more...]
Water Consumption in Liquid-Cooled Data Centers Remains a Concern
Though water is not used by all data centers, it is a critical component for some data center cooling systems and overuse of it can potentially affect area water supplies. Large data centers using evaporative cooling can consume up to hundreds of thousands of gallons of water per day and could potentially exceed utilities’ ability to supply water, putting pressure on … [Read more...]
New Software Added to Computer-Aided Engineering Software Suite
Altair, the developer of the HyperWorks computer-aided engineering software suite, has announced the addition of TES International’s software ElectroFlo to the group of applications available through the HyperWorks Partner Alliance (HWPA). ElectroFlo is an electronics cooling package with a user-friendly graphical interface used for the thermal analysis of electrical components … [Read more...]
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