Introduction As increasing functionality is packaged into ever-shrinking electronics, cooling requirements rise exponentially. While there have been continued advances in high heat flux technologies [1], commercial, consumer-oriented systems continue to focus on aircooling for reasons of reliability, acoustics, cost and portability [2]. In order to support the increasing power … [Read more...]
Effect Of Improved Thermoelectric Zts On Electronic Module Coolability
In recent years there has been a growing interest in the application of thermoelectrics to electronics cooling. Attention has been focused on thermoelectric cooling both as a possible means to enhance module cooling and to address the chip hot spot problem. Effort has been directed towards the development of new bulk materials and thin film micro-coolers. The usefulness of … [Read more...]
Liquid Cooling Of A High-Density Computer Cluster
Introduction Recent advances in computer clusters have resulted in the introduction of higher density server equipment that consumes significant amounts of electrical power and produces an extraordinary amount of heat. Due to this latter attribute, which has alarming consequences with regard to thermal management, the installation of modern computer clusters will require … [Read more...]
Thermal Challenges In LED Cooling
Introduction During the last ten years, developments in LED semiconductors have led to an important change in LED applications from that of luminous indicator to that of illuminator. With LEDs now advancing into several lighting fields, LEDs have become one of the standard methods of producing light, joining more traditional sources such as incandescent, fluorescent and … [Read more...]
Solid-State Microrefrigerator on a Chip
Introduction Temperature control of microelectronic devices has become more important in recent years. Device miniaturization and higher switching speeds have increased power dissipation substantially. Limiting the maximum die temperature has resulted in an increase of packaging complexity and cost. The failure rates resulting from electromigration and oxide breakdown are … [Read more...]
- « Previous Page
- 1
- …
- 48
- 49
- 50
- 51
- 52
- …
- 56
- Next Page »