As Electronics Cooling engineers, we can say this unequivocally –the root cause of heat in electronics systems is power! Barring external and environmental influences, heat dissipation in electronic devices is an unavoidable side effect in any powered electronic device. In this blog, we will take a look at the Internet of Things (IoT) Gateways, in particular Edge Gateways … [Read more...]
A Novel Approach to Development of a Thermal Capacitor
INTRODUCTION In terrestrial or air-borne electrical and electronic systems, cooling requirements can be unsteady due to spikes in heat load, or changes in ambient conditions. Such an event results in a sharp rise in system temperature or temperature cycling thus possibly reducing the system reliability. In the electrical domain, fluctuations in voltage are managed by using … [Read more...]
Case Study: Thermal Design and Analysis of a Combat-Ready Electronics Unit
INTRODUCTION Militaries continue to expand their use of electronics in harsh environments while preserving an absolute minimal risk of failure. In this regard, effort spent early in the design process on concept development, parametric and trade-off studies, and simulation-driven design can yield amplified benefits in terms of product performance and reliability, reduced … [Read more...]
Book Review: Thermal Design and Thermal Behaviour of Radio Telescopes and their Enclosures (2010)
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Complementing Electronics Cooling’ article on Cooling the DARPA Space Surveillance Telescope, we are pleased to bring you a book review on the Thermal Design and Thermal Behaviour of Radio Telescopes and their Enclosures. As you may have read from the article on DARPA’s SST, electronics … [Read more...]
Pluggable Optics Modules – Thermal Specifications: Part 2
By Terence Graham and Bonnie Mack, Ciena Corporation Introduction In Part 1 of this article [1] the overall thermal environment for pluggable optical modules (POMs) was described, with the effect of both out of flatness and source locations relative to heatsink contact area also examined. The article also introduced the relevant sections of the multi-source agreements … [Read more...]
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