(April 29, 2016) Recently, a team of researchers from Chalmers University of Technology in Sweden have developed a more efficient approach to cooling electronics using graphene nanoflake-based film. According to E&T, the team performed “experiments in which they managed to increase the efficiency of heat transfer by 76 per cent” – the kind of results that suggest … [Read more...]
Metal Inverse Opals Could Better Cool Electronics
(April 7th, 2016) New work by researchers at Stanford University and the University of Illinois at Urbana-Champaign, suggest that “metal inverse opals” could be used to cool down electronic devices as well as other thermal management applications. Nanotechweb.org explained that “these materials are metal films that contain a periodic arrangement of interconnected spherical … [Read more...]
New Approach to Simulate Nanoscale Thermoelectric Materials
(April 7th, 2016) A research group led by Joe Feser, assistant professor in the Department of Mechanical Engineering at the University of Delaware, has developed a new approach to simulating nanoscale heat transfer in materials, according to Phys.org. More specifically, the research group is “investigating the limits of heat transport using a suite of new tools for nanoscale … [Read more...]
Small EHD Pump Solution May Cool Space Hardware
(April 13th, 2016) Michal Talmor, a Ph.D. candidate in mechanical engineering at the Worcester Polytechnic Institute (WPI) in Worcester, Massachusetts, is focused on bringing electrohydrodynamic (EHD)-based thermal control to space exploration devices. Now in the second year of her NASA Space Technology Research Fellowship (NSTRF), according to I-Connect007.com, “Talmor’s … [Read more...]
New Market Entry of Sealed Enclosure Coolers
As their “first step” into the sealed enclosure cooling market, Advanced Cooling Technologies (ACT) has recently launched its HSC, HPC and LNC series of sealed enclosure cooler products. ACT said this about each of their new products: “ACT’s HSC series of coolers are based on a patent pending design that utilizes the air impingement technology that is thermally efficient and … [Read more...]
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