As their “first step” into the sealed enclosure cooling market, Advanced Cooling Technologies (ACT) has recently launched its HSC, HPC and LNC series of sealed enclosure cooler products. ACT said this about each of their new products: “ACT’s HSC series of coolers are based on a patent pending design that utilizes the air impingement technology that is thermally efficient and … [Read more...]
Company Doubles Compute Capacity within Existing Racks with Liquid Cooling Upgrade
Cascade Technologies is deploying direct contact liquid cooling from CoolIT Systems to increase their compute density by 2.5 times within their existing floor space, rack space and air conditioning capacity. “The upgraded Cascade cluster now combines over one hundred Dell C6100 dual processor servers across two racks with CoolIT Systems Rack DCLC heat exchanger solutions to … [Read more...]
New Refrigerant-Based Rack and Row Cooling Solution for IT Equipment
Rittal Corporation has recently introduced a new refrigerant-based rack and row cooling solution, LCP DX, for heat removal of critical IT components. The Rittal Rack LCP DX “puts the cooling only where needed to protect valuable IT equipment while minimizing energy costs” and “includes air-flow optimized enclosures with includes baffles and blanking panels,” said the … [Read more...]
Overcoming Cooling Challenges Downloadable Webinar Now Available
The recent Electronics Cooling with Autodesk CFD Webinar on how to ensure proper cooling as the electronics used in products change and improve is now available for download. Exploring ‘invisible elements’ like airflow and heat transfer, speaker Jim Byrne talks through how to maximize product performance by overcoming common electronics challenges like reduction in product … [Read more...]
Registration for Thermal Conference Opens
ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and engineering exploration of thermal, thermo-mechanical and emerging technology issues associated with electronic devices, packages, and systems. According to the … [Read more...]
- « Previous Page
- 1
- …
- 16
- 17
- 18
- 19
- 20
- …
- 24
- Next Page »
