Fujipoly released Sarcon 100GR-FL, a low resistance, durable thermal interface gap filler pad. The gel-like material is manufactured with an integrated nylon mesh layer that prevents distortion and stretching during die-cut operations. When placed between a heat source such as a high-performance semiconductor and a nearby heat sink, Sarcon 100GR-FL will transfer heat with a … [Read more...]
System Measures Pressure Distribution between Heat Sinks, Components
The new Tactilus® heat-sink analysis system by Sensor Products Inc. enables research and design engineers to quickly and precisely test and correct the surface contact and pressure distribution between the heat sink and its source. Even a slight warping of the heat exchange structure or reduction in surface contact area can have a profound effect on cooling efficacy. If the … [Read more...]
Cooling High-Power Electronic Components in Small Packages
Thermacore’s Therma-Base vapor chamber is used as the base of a heat sink to alleviate spreading resistance found in solid heat sink construction, which enables lower device temperature and greater component reliability. The chamber features effective thermal conductivity over 5,000 W/mK; application improvement of over 30% in high-flux, poor spreading applications; and over … [Read more...]
Thermal Grease Screen Printers
Surface Mount Techniques (SMT) announces stencil/screen printers specifically designed for thermal grease applications. Highly concentrated heat sources found in ever shrinking electronic designs have increased the demand for better heat dissipation. The demand is seen across many industries: power electronics, electric vehicles (EV), ever shrinking handheld devices and … [Read more...]
Thermal Gap Fillers Combine High Performance, Low Pricing
New TP-S30 thermal interface pads from MH&W International provide 3.0 W/mK of thermal conductivity between hot components and heat sinks at lower costs than competing gap filler materials. Pads of TP-S30 thermal gap fillers are soft and compliant for easy compression and filling of air gaps between mounting surfaces to optimize heat transfer. Applications for these gap … [Read more...]
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