GlacialTech has introduced the IGLOO 5760 Multiple Platforms CPU cooler. This design incorporates a specially aligned copper heat pipe combination of three pipes that disperse the heat from the CPU directly into the heat sink fins. From there, the silent bullet axial fan quietly and efficiently brings the temperature down. The fan not only cools the radiator, but the added blow … [Read more...]
ElectronicsCooling Spring 2010 Print Issue
Did you miss us? For those of you that are faithful readers of Electronics Cooling, we are pleased to inform you that after a short interval of restructuring, we have resumed publication. Given the recent downturn in the economy as a whole, and specifically within the electronics thermal management community, we can hope that this is a sign of improvement and recovery. We will … [Read more...]
integrating vapor chambers into thermal solutions
Introduction Often in high power density or low profile heat sink applications, the spreading resistances in the base of the heat sink limits the performance of the design. Once it is determined that normal heat sink materials, aluminum or copper, are either insufficient or too bulky to meet the design objectives, the obvious next step is to look at two phase … [Read more...]
a case study to demonstrate the trade-offs between liquid and two-phase cooling schemes for small-channel heat sinks in high heat flux applications
Introduction Small-channel heat sinks provide an extremely compact and efficient vehicle for dissipation of large heat fluxes typically found in high power electronics. Fluid flow and heat transfer in small-sized channels, with hydraulic diameters on the order of a fraction of a millimeter (a few hundred micrometers), have been shown to behave similarly to conventional-sized … [Read more...]
New heat sink series provide secure attachment with minimum of board real estate
Alpha’s series of heat sinks feature an innovative attachment mechanism. Electronic components have become faster and more compact, generating more heat and increasing thermal densities. This has led to the use of heat sinks of increased size and mass. One of the biggest challenges for thermal/mechanical engineers is mechanically mounting larger heat sinks while minimizing the … [Read more...]
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