In the last issue of ElectronicsCooling a methodology was presented for estimating parallel plate-fin heat sink thermal resistance [1]. The method presented assumes that the air flow rate is given, either in terms of the average velocity, V, between the fins or a volumetric flow rate, G. Although this methodology was shown to be useful in examining the effects of heat sink … [Read more...]
How Much Heat can be Extracted from a Heat Sink?
Thermal transport from a heat sink creates a unique condition in heat transfer and fluid flow once it is placed on a PCB in an unducted fluid flow delivery system. Although a heat sink may appear structurally simple, the fluid flow through its fin field and thermal coupling between it and the surrounding create a rather complex problem. As a result, heat sinks are often … [Read more...]
Estimating Parallel Plate-Fin Heat Sink Thermal Resistance
As noted previously in this column, the trend of increasing electronic module power is making it more and more difficult to cool electronic packages with air. As a result there are an increasing number of applications that require the use of forced convection air-cooled heat sinks to control module temperature. An example of a widely used type of heat sink is the parallel plate … [Read more...]
Electroosmotic Microchannel Cooling System for Microprocessors
Computer heat sinks, such as fin arrays and heat pipes, are much larger than silicon chips and are continuing to grow in size. This trend is driven by the increasing chip heat generation rates and has serious implications for overall system performance. The large volume of existing heat sinks causes discrete memory, video, and power-delivery components to be crowded away from … [Read more...]
Numerical Modeling and Experimental Verification of High-density Servers
High-density hardware and software are developed as part of an initiative to greatly increase data center compute densities. Concept systems presented here are based on the Intel® Itanium™ processor family and are designed for a 1U rack-mount form factor. The current dual-processor system concept is targeted at the front-end server market (e.g., web hosting and mail routing), … [Read more...]
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