Introduction Microprocessor and system thermal management are linked to facility cooling: power dissipation and cooling techniques employed at one end of the size scale have cascading impacts at the other extreme (Figure 1). For example, ineffective airflow distribution or insufficient underfloor static pressure in a data center can reduce the supply airflow rate from … [Read more...]
Solve Thermal Issues Earlier in Updated Board Designs
Introduction Often new products or product concepts only introduce some new aspects and rely heavily on existing designs. At the board level this often means only one section of a board is retooled or upgraded; an approach that can save significant time and money. Unfortunately, we cannot rely solely on previous work because the interaction of old functions and new features … [Read more...]
Metal Injection Molding Of Heat Sinks
Introduction New thermal management solutions are needed to provide cost-effective means of dissipating heat from future generation microelectronic devices. A relatively new process to reduce the costs of fabricating large quantities of complex components, such as heat sinks, is metal injection molding (MIM), a net-shaping process in which metal powder is mixed with a … [Read more...]
Use Of Heat Pipe Cooling Systems In The Electronics Industry
Introduction Thermal management of electronic components must solve problems connected with the limitations on the maximum chip temperature and with the requirements on the level of temperature uniformity. To cool electronic components, one can use air and liquid coolers as well as coolers constructed on the principle of the phase change heat transfer in closed space; i.e., … [Read more...]
Opto-electronic Transceiver Modules, a System Design Perspective
Introduction Small Form Factor (SFF) optical transceiver packages for use at 1-2 Gbits/s data rates have been described by several authors [1-5]. These rely on dual miniature optical connectors such as the MT-RJ or the LC to provide optical-component case widths as small as one centimeter. Passive alignment of the optical fibers with the active optical devices is achieved with … [Read more...]
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