As most readers are no doubt aware, the trend towards ever increasing processor module power is making it more and more difficult to cool directly with air. Many thermal engineers are convinced that water cooling may be the answer. This does not necessarily mean that cooling water must be supplied by the customer. Instead, in some instances it may be possible to use a … [Read more...]
Flash Diffusivity Method: A Survey of Capabilities
The development, specification, and quality control of materials used in electronics packaging and thermal management often require the measurement of thermophysical properties.This data can be critical to a successful design, especially with the rapidly increasing cooling requirements that result from the packaging of higher performance devices. A variety of methods, involving … [Read more...]
Thermal Design Challenges in Automotive Alternator Power Electronics
Ever since the advent of the automotive alternator, or claw-pole alternating current generator, in the 1960's, there has been an ever-increasing thermal design challenge to cool the power electronics in these machines. Figure 1 depicts a typical cutaway section of a modern day alternator. At first glance one may think that cooling the diodes in a rectifier bridge of an … [Read more...]
Estimating Natural Convection Heat Transfer for Arrays of Vertical Parallel Flat Plates
A simple formula to estimate the natural convection heat transfer coefficient on a flat plate was presented in a preceding column [1]. If, instead of a single plate, we wish to consider a closely spaced array of vertically oriented parallel flat plates, a different formula is required. The geometry to be considered appears in Figure 1 and is typical of that for a vertically … [Read more...]
Diamonds are a Thermal Designer's Best Friends
Different forms of carbon, such as processed natural graphite, pyrolytic graphite, diamond-like carbon, and synthetic diamond, offer lots of possibilities for maximizing conductive heat transfer.Synthetic diamond has already found its place as a common solution for heat spreaders inside semiconductor laser components, where temperature stabilization is of utmost importance for … [Read more...]
- « Previous Page
- 1
- …
- 49
- 50
- 51
- 52
- 53
- …
- 57
- Next Page »
