A team of researchers at the University of Cambridge, along with the Cambridge-based company Novalia, have produced new graphene-based inks which could lead to high-speed manufacturing of printed electronics. The method involves adding graphene and electrically conducting materials to water-based inks for printing. This is the first time graphene has been used for large-scale … [Read more...]
Company CEO Asks “Is Free Cooling Really Free?” At Conference
CEO of LiquidCooling Solutions, Inc., Herb Zien, is serving on a panel until Thursday, Sept. 24, at the North America’s Emerging Green Conference in Portland, Oregon. On Wednesday Sept. 23, from 1:30 – 3:00 p.m., Zien will give a presentation that challenges the legitimacy of Free Cooling. Zien will explain inefficiencies and environmental waste associated with free cooling via … [Read more...]
Cooling Matters
AIR FORCE INQUIRES ABOUT THERMAL MGMT.SOLUTIONS FOR FUTURE AIRCRAFT 8/11/15 - The U.S. Air Force is looking into new thermal management techniques to cool the electronics in future fighter aircraft. “Officials of the Air Force Research Laboratory at Wright-Patterson Air Force Base, Ohio, issued a broad agency announcement Friday (BAA-AFRL-RQKP-2015-0002) for the Hybrid-Cycle … [Read more...]
Comparison of HPC and Telecom Data Center Cooling Methods by Operating and Capital Expense Extended Article
Dr. Alexander Yatskov Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center cabinets have already surpassed 30 kW per cabinet (or 40.4 kW/m2) [1]. It is not an unreasonable assumption to expect that, in accordance … [Read more...]
Data Center Energy Savings: Total Liquid Cooling Versus Indirect Liquid Cooling
By: Yong Quiang Chi, Peter Hopton and Keith Deakin, Iceotope Ltd Jonathan Summers, Alan Real, Nik Kapur and Harvey Thompson, University of Leeds Introduction Improvements in energy efficiency and performance of data centers are possible when liquid is supplied to the racks [1]. A solution which has become popular for dense racks is the rear-door water-cooled heat … [Read more...]
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