Introduction This article is a use of helpful comparison of common thermal solutions you may want to consider with the overall increase in automation in the electrification of the world. We'll focus on two distinct segments within the industrial market, one being energy management and the other being automation and control applications such as solar and wind inverters. … [Read more...]
Utilizing Boyd Coolant Distribution Units (CDUs)
Introduction Let's begin with two images that may be familiar, but will provide a very good illustration to help us frame the current market trend and why liquid cooling is on the rise. The two charts in Figure 1 show actual CPU and GPU power consumption over the years, and Figure 2 shows an overall trend in chip power. As we can see here at this point, in 2023 at 700 … [Read more...]
Statistics Corner: Weibull Distribution
A little over a pandemic ago, the first article in this series on statistical analysis mentioned that a fundamental aspect of statistics is that one assumes a mathematical model that describes the distribution of a data set and then uses that model to estimate the probability that a given value or set of values will occur [1]. This allows us, for example, to estimate whether … [Read more...]
Heat Transfer and Pressure Drop Correlations for Manifold Microchannel Heatsinks
Written by: Sevket U. Yuruker, Raphael K. Mandel, Amir Shooshtari and Michael M. Ohadi - Department of Mechanical Engineering, University of Maryland Conventional microchannel cooling has been proven capable of removing high heat fluxes, but usually at significant pressure drops. On the other hand, manifold microchannel systems offer high heat transfer coefficients/heat … [Read more...]
Machine Learning Optimization to Boost the Effectiveness of Phase Change Material (PCM)-Based On-Chip Passive Thermal Management
Written by: Dr. Amy Marconnet and Meghavin Bhatasana - Purdue University Although miniaturization of electronic components has helped advance computing power and accelerated technology development, it has increased power densities and exacerbated the already challenging issue of electronics cooling at the component level. Continuous operation at high temperatures degrades … [Read more...]
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