It was very interesting to read this article about the work IBM are undertaking together with École Polytechnique Fédérale de Lausanne (EPFL) and the Swiss Federal Institute of Technology Zurich (ETH) on a 3D stacked architecture for multiple cores. The four year collaborative project, called CMOSAIC, promises to deliver an interconnection density from 100 to 10,000 connections … [Read more...]
Liquid Cooling – Are We There Yet?
Back in June I posted ‘Air – Is it Running Out of Gas?’ and put forward the view that for general computing applications air isn’t running out of gas just yet. There are a couple of reasons for that. One is that I suspect the general public has concerns about leaks. Most people have passed cars stuck on the highway with a blown heater hose and seen water on the ground, and I’ve … [Read more...]
Back to the Future with a Liquid Cooled Supercomputer
Introduction: Evolution of Air and Water Cooling for Electronic Systems Since the development of the first electronic digital computers in the 1940s, efficient removal of heat has played a key role in insuring the reliable operation of successive generations of computers. In many instances the trend toward higher circuit packaging density to provide reductions in circuit delay … [Read more...]
Direct Spray Cooling and System-level Comparisons
Introduction As power densities of embedded electronics increase, cooling becomes a challenge especially in harsh environments. Liquid cooling is accepted as an attractive cooling method for an increasing number of applications. Direct spray is a particularly efficient form of liquid cooling that has recently been included on several manned and unmanned military platforms. This … [Read more...]
Using a Matrix Inverse Method to Solve a Thermal Resistance Network
Today virtually all serious thermal analysis and design calculations for electronic packages are performed using various commercial flow and thermal conduction codes. Nonetheless, there are still many instances, especially in the early phases of a project, when the thermal engineer finds it advantageous to perform so called "back of the envelope" calculations without resorting … [Read more...]
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