Experts say a new technique called superwicking could provide a better way to cool computer hardware and could help remove one of the biggest barriers to a new generation of high-powered microprocessors. And in the meantime, it could prove a boon to tiny fluid-based sensors. Optical physicists Chunlei Guo and Anatoliy Vorobyev of the University of Rochester in New York state … [Read more...]
Data center cooling solutions cut energy consumption and costs
Coolcentric™, a new division of Vette Corp.®, offers patented LiquiCool® technology in a variety of turnkey data center cooling system solutions that can reduce cooling unit energy consumption by up to 90 percent and lower total data center cooling costs by as much as 60 percent. These liquid cooling systems include Rear Door Heat Exchangers (RDHx) that mount to the back of IT … [Read more...]
Universal liquid cooling system for graphics cards
CoolIT’s OMNI ALC is a universal liquid cooling system for graphics cards. The OMNI’s water block is compatible with a wide range of video cards by simply swapping out a low-cost customized interposer plate. Alleviating the need to purchase an entirely new cooling solution for each new generation of video card, the system is a fully upgradeable, factory sealed, liquid cooled … [Read more...]
3D chip stacking to take Moore’s Law past 2020, pose new chip cooling challenges
A team of IBM Researchers in collaboration with two Swiss partners are looking to keep “Moore’s Law” alive for another 15 years. The law states that the number of transistors that can be placed inexpensively on an integrated circuit will double every 18 months. More than 50 years old, this law is still in effect, but to extend it as long as 2020 will require a change from mere … [Read more...]
IBM Work to take Moore’s Law to 2025
It was very interesting to read this article about the work IBM are undertaking together with École Polytechnique Fédérale de Lausanne (EPFL) and the Swiss Federal Institute of Technology Zurich (ETH) on a 3D stacked architecture for multiple cores. The four year collaborative project, called CMOSAIC, promises to deliver an interconnection density from 100 to 10,000 connections … [Read more...]
- « Previous Page
- 1
- …
- 54
- 55
- 56
- 57
- 58
- …
- 64
- Next Page »
