With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design. Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment. The relationship between the … [Read more...]
Safety tips and techniques for FEA in modeling solids
Using commercially available finite element analysis (FEA) software is easier today than it has ever been. Software vendors have made great progress toward providing programs that are as easy to use as they are powerful. But, in doing so, software suppliers have created a perilous quagmire for unwary users. Some engineers and managers look upon commercially available FEA … [Read more...]
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