Rathbun Associates, a provider of 3M thermal, VHB and EMI solutions, has released 3M thermally conductive acrylic interface pads, high-performance non-silicone-based thermal pads for use in non-silicone applications. According to the company, the new acrylic thermal interface pads provide “good softness and conformability to non-flat surfaces [and] excellent compressive stress … [Read more...]
New Metal Oxide-Silicone Thermal Compound Offers Thermal Conductivity of 7.5W/mK
German power supplies manufacturer Be Quiet! Has released DC1, a new high performance thermal compound for critical cooling applications. According to the company, the new electrically non-conductive, metal oxide-silicone thermal compound features a “very high thermal conductivity of 7.5w/mK [that] provides exceptional heat transfer between chip and cooler” and is capable of … [Read more...]
New Type of Heat-Conducting Paste “Optimized” for Thermal Management of Power Semiconductors
Infineon Technologies AG and Henkel Electronic Materials have collaborated to release a new type of heat-conducting paste “optimized” for thermal management of power semiconductors. According to the two companies, the new compound allows a higher power density for the same ageing resistance. According to Dr. Martin Schulz of Infineon Technologies AG, “[LOCTITE TCP 7000] … [Read more...]
Ultrathin “Nanoglue” Increases Heat Transfer Rate Across Metal-Ceramic Interface
Researchers at the Rensselaer Polytechnic Institute (RPI) in New York have developed a new method for increasing the heat transfer rate across two different materials. The team hopes that the study, titled “Bonding-Induced Thermal Conductance Enhancement at Inorganic Heterointerfaces Using Nanomolecular Monolayers,” will lead to new advances in cooling computer chips and LED … [Read more...]
Researchers Develop Possible New Heat Dissipation Method with Cold Plasma Treatment
Researchers from the College of Materials Science and Engineering at Beijing University of Chemical Technology in China have determined a new method for enhancing heat dissipation in microelectronics based on research on plasma-treated h-BN fillers. According to results published by Professor Yonglai Lu and Tui Ji, a master of engineering at the Center of Advanced Elastomer … [Read more...]
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