Formulated for structural applications in extreme environments with temperatures from -80°F to +425°F, Master Bond Supreme 33 has superior resistance to thermal cycling, thermal shock and impact. This toughened, two-component epoxy offers high structural bond strength to a wide variety of substrates including metals, glass, ceramics, wood, vulcanized rubbers and many plastics. … [Read more...]
Thermal Company Partners With Packaging Services Firm
Thermal Engineering Associates (TEA) is partnering with engineering services firm, Package Science Services (PSS) to provide measurement, modeling and simulation of IC packages for a number of its customers. The pooling of TEA and PSS resources provides thermal measurement and modeling capability for IC, diode, transistor, LED, and PV devices and related packaging alternatives. … [Read more...]
Groups Develop Thermal Nanotape for Packaging
(a) A nanostructured interface material is used around the module; (b) a nanostructured interface material is used between the thermoelectric material and metal leads. Semiconductor Research Corporation (SRC) and researchers from Stanford University have developed a novel combination of elements that yields a nanostructure material for packaging. The advance could mean … [Read more...]
Testing Thermal Interface Material (TIM) Analysis
2-3 p.m., March 10 This webinar will provide an introduction to the most commonly used Thermal Interface Material (TIM) types and their corresponding testing techniques. Basic TIM properties such as bulk or effective thermal conductivity, interfacial thermal resistance and bond line thickness will be explained. At the beginning, an overview of the existing industrial and … [Read more...]
Making Sure Your Chips Don’t Burn
Researchers at the Tyndall National Institute at University College Cork in Ireland have found a new way of cooling semiconductors in computers, mobiles and games consoles to improve their performance and reduce energy consumption. Most computers have thermal interface materials (TIM) to join the chip with the heat sink, with solder or a thin, film-like sheet. Solder is … [Read more...]
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