Forced convention air cooled heat sinks and liquid cooled cold plates are quite pervasive in their use in electronics cooling applications. While there can be significant debate on whether to air or liquid cool a particular component, the approach a thermal engineer would adopt to design both components is essentially similar. Parallel plate fins are the most common geometry … [Read more...]
Product & Industry News
Mitsubishi Adds LED-Based Cube to Display Wall Line-up Mitsubishi Digital Electronics America’s Presentation Products Division has expanded its SeventySeries display wall line with the SeventySeries: LED, an LED-based, rear-projection display wall cube designed specifically for control and command rooms for government, traffic and utility facilities, and network operations … [Read more...]
Forced-Air Enclosure for Conduction-Cooled Embedded Computing Boards
Extreme Engineering Solutions (X-ES) in Middleton, Wis., is introducing the 8.8 pound XPand4200, a sub-half-ATR, forced-air-cooled enclosure for conduction-cooled modules for embedded computing in vetronics and avionics applications in unmanned aerial vehicles (UAVs), helicopters, fixed-wing aircraft, armored vehicles, and unmanned ground vehicles (UGVs). Electronics thermal … [Read more...]
Thermal Optimization And Design For Manufacturability Of Liquid-Air Hybrid Cooling Systems
Introduction Existing technologies typically utilize air to carry the heat away from a heat sink that is thermally coupled to the microprocessor. Higher performance devices such as workstations, "gaming" PCs, or tower servers that utilize components with greater power dissipation can require more aggressive cooling technology. A high-performance alternative to heat sinks is a … [Read more...]
Liquid Cooling Of A High-Density Computer Cluster
Introduction Recent advances in computer clusters have resulted in the introduction of higher density server equipment that consumes significant amounts of electrical power and produces an extraordinary amount of heat. Due to this latter attribute, which has alarming consequences with regard to thermal management, the installation of modern computer clusters will require … [Read more...]