Chips are getting hotter, and liquid cooling is moving from niche to necessary. That transition changes what “good” looks like for fluid connections. Quick disconnect couplings have long lived in industrial settings, where design tolerances, qualification habits, and manufacturing controls matched those use cases. Data center liquid cooling—along with aerospace/defense and … [Read more...]
Gates Strengthens Data Center Portfolio with Launch of Data Master™ Eco
Gates Corporation, a global manufacturer of innovative, highly engineered power transmission and fluid power solutions, has launched Data Master™ Eco. This next-generation liquid cooling solution is designed to support hyperscale data centers and high-performance computing (HPC) conditions to maximize uptime, reduce environmental impact and meet the complex AI-enabling, data … [Read more...]
Alloy Enterprises Extends Direct Liquid Cooling Across the Blade, Eliminating the 100 kW Peripheral Heat Bottleneck
Boston, MA – November 5, 2025 – Alloy Enterprises today announced a breakthrough in data center cooling: single-piece, leak-tight cold plates that extend direct liquid cooling (DLC) across the blade, including DIMMs, NICs, and QSFPs. Built using the company’s patented Stack Forging™ process, the new design enables full-blade liquid cooling for the first time, eliminating the … [Read more...]
Heat-pipes May be a Solution for Heat Dissipation in New Smartphone
According to Chinese site UDN, Samsung is looking for a heat-pipe supplier to dissipate heat from the Galaxy S7 smartphone's processor. “Tiny pipes inside the phone are filled with a liquid coolant, which circulates around the heat-producing components like the chipset and then away, taking excess heat with it,” Slash Gear reported. Because space is limited in smartphones, … [Read more...]
Thermal Ground Plane Vapor Chamber Heat Spreaders for High Power and Packaging Density Electronic Systems
SINCE 2008, collaborative research conducted at Raytheon Company, Thermacore Incorporated, Purdue University and Georgia Tech Research Institute has pursued the development of Thermal Ground Plane (TGP) technology. The DARPA-sponsored Radio Frequency Thermal Ground Plane (RFTGP) program focused on the development of high effective conductivity (keff >1000W/mK), low … [Read more...]
