This column has emphasized methods of analyzing packages in the JEDEC-standard test environment. A thermal metric that lends itself to analyses of system applications is the junction-to-board thermal characterization parameter, JB. If one knows the board temperature (TB), then the junction temperature (TJ) can be determined by a simple application of the following formula: TJ … [Read more...]
Use of JEDEC Thermal Metrics in Calculating Chip Temperatures (without Attached Heat Sinks)
Bruce Guenin Assoc. Technical Editor, Electronics Cooling INTRODUCTION JEDEC single-chip package thermal metrics are widely used as a means of characterizing the thermal performance of semiconductor packages. They correlate the peak temperature of a uniformly-heated semiconductor chip (the junction temperature, TJ) with the temperature of a specified region along the heat … [Read more...]
Calculation Corner: A Useful Catalog of Calculation Corner Articles
The first issue of ElectronicsCooling magazine was published in June 1995 with Kaveh Azar as Editor-in-Chief. In 1997 Bruce Guenin joined ElectronicsCooling as an Associate Editor. In the September issue, he published the first Calculation Corner article, which provided a simple description of “One-Dimensional Heat Flow” and occupied one-half page. I was invited to join … [Read more...]
Use of the Monte Carlo Method in Packaging Thermal Calculations
INTRODUCTION The state of the art in performing thermal calculations in our industry is very advanced. However, how applicable the results of a calculation are to the real-world performance of a packaging or an active cooling component depends on the quality of the data characterizing these various components. In the real world of manufacturing, such characterization … [Read more...]