Materials, Compounds, Adhesives, Substrates

Diamond-Mineral Oil Mix May Be Best Heat Transfer Nanofluid, Say Researchers

April 17th, 2014

A mixture of diamond nanoparticles and mineral oil may be the most effective nanofluid for heat transfer applications, according to new research from Rice University. Thermal fluids are used in a variety of applications, from…read more

Microchips Tolerate Extreme Temperatures in Industrial Applications

April 4th, 2014

German scientists have successfully fabricated compact microchips able to tolerate temperatures up to 300°C in an achievement that could have significant implications for the geothermal and oil production industries. Drill bits and borehole probes employed…read more

New Thermal Adhesive Boasts Twice the Conductivity at Half the Cost

April 4th, 2014

3M’s Electronics Markets Materials Division (EMMD) has released 3M 8904, a thermally conductive adhesive tape for thermal management and part bonding in electronic devices, as well as general heat dissipation. Containing thermally conductive particles as…read more

Researchers Pinpoint Heat Movement in Nanostructures

March 25th, 2014

Researchers at Cornell University have developed a new method of precisely measuring the subtle movement of heat in nanostructures. Heat flows at the nanoscale differently than at larger scales, the researchers say, and understanding how…read more

Thermally Conductive Copper Grease for High-Temp Heat Transfer

March 21st, 2014

Aremco has released Heat-Away 640, a new high temperature, thermally conductive, copper-filled grease for use in heat transfer applications from –60 to 550 ºF (-51 to 288 ºC). Designed to improve the thermal transfer between…read more

Form-in-Place Thermal Compound for Delicate or Low Compression Requirements

March 11th, 2014

Fujipoly has released SARCON SPG-50A, a form-in-place gap filler material with a thermal conductivity of 5.0 W/m°K. Exhibiting ultra-low compression force, the new silicone-based compound is ideal for applications that have delicate components or low…read more

SEMI-THERM 30 Media

March 11th, 2014

Photos Videos Colder Products Company Discusses New Products at SEMI-THERM 30. The Bergquist Company Discusses Products at SEMI-THERM 30.

Graphene Improves Copper Film Thermal Conductivity

March 11th, 2014

The placement of a single atomic plane of graphene on the surface of a copper film can significantly increase the film’s thermal conductivity, making the hybrid material ideal for more demanding thermal management applications, according…read more

Gummy Electrolyte Could Reduce Battery Fire Hazard

March 10th, 2014

Researchers at Washington State University have developed a new conductive gum-like material that could improve the safety of lithium ion batteries. Used in laptops, smartphones and other electronic devices, lithium ion batteries are capable of…read more

Nanoscale Pillars May Improve Thermoelectric Materials

March 10th, 2014

Researchers at the University of Colorado Boulder say a new method of improving thermoelectric materials could lead to the development of better solar panels, more energy-efficient cooling equipment and effective devices that could turn waste…read more

Thermal Pad Offers Advantages of Thermal Grease Without Mess

March 3rd, 2014

AOS Thermal Compounds has released Micro-Faze, a new thermal interface material formulated with non-silicone thermal grease. Micro-Faze offers a number of technical advantages, including low thermal resistance with minimum force and conformance with coefficient of…read more

Ultra-Thin Titanium Based Thermal Solution for Electronic Applications

February 28th, 2014

Payam Bozorgi and George Fleischman PiMEMS, Inc. Introduction As electronic system technology advances with continual increases in requirements leading to greater demand for higher power consumption, there have been growing challenges related to the design…read more

Towards Reproducible ASTM D5470 Measurements at Lower Cost

February 28th, 2014

Baratunde A. Cola Georgia Institute of Technology INTRODUCTION  ASTM D5470 (updated to ASTM D5470-12 in 2012) [1] remains an industry standard for characterizing thermal interface materials (TIMs) despite some drawbacks. Ultimately, a TIM must be…read more

Prehistoric Cave Paint to Shield Solar Spacecraft

February 21st, 2014

A European spacecraft scheduled for launch towards the sun in 2017 will be shielded from extreme temperatures by a type of paint once used in prehistoric cave art. Carrying instruments to perform high-resolution imaging of…read more