Materials, Compounds, Adhesives, Substrates

New Technology Improves Heat Dissipation Performance

May 26th, 2015

OKI Circuit Technology in Japan has developed a mass-production technology for multi-layer copper-coin printed circuit boards that supports high speeds and high frequencies. The technology is a T-Coin (Technology of copper coin insert) structure that…read more

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New Gap Filler Improves Heat Management in Automotive Electronics

May 20th, 2015

Dow Corning introduces the TC-4525, a thermally conductive gap filler that offers advanced heat management in automotive electronics. This gap filler is two-part silicone, soft, compressible and cost-effective. It can be used directly from its…read more

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New Hot Melt Adhesive Offers Instant Green Strength

May 11th, 2015

Dow Corning announces a new hot melt room-temperature vulcanization (RTV) black adhesive, the EA-4600. It’s a one-component, moisture-cure and solventless silicon material, designed to improve assembly of consumer electronics and other devices such as smart…read more

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UPenn Physicists Discover New Material that May Cool Computers

May 5th, 2015

Heat emitted from computers, laptops and other electronic devices during use is regularly caused by numerous transistors overcrowded in the devices. This also expels large amounts of wasted heat energy. A pair of physicists from…read more

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Trio of Companies to Improve Graphite Thermal Management Products

April 27th, 2015

Three Canadian companies, Terrella Energy Systems, Alpha Technologies, and Westport Innovations, have partnered up to improve low-cost graphite thermal management products. The companies have partnered with researchers at Simon Fraser University and Ontario’s Sheridan College…read more

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Thermal Foil Sheets Offer Advanced Thermal Management in Smartphones

April 13th, 2015

Angstron Materials Inc. has developed a family of thermal foil products ideal for smartphones, and other hand-held devices. The new thermal foil sheets have a thickness of from 5 um to 40 um and thermal…read more

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Temporary Bonding Adhesive for 3D Wafer Integration

April 6th, 2015

AI Technology Inc. introduces its new 3D TSV ultra thin wafer processing adhesive (WPA) for thin wafer processing. The new adhesives are thermally stable to 320-330 degrees Celsius and have high bond strength. “In comparison…read more

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New Conductive Adhesives and Inks Announced

March 9th, 2015

Creative Materials, Inc. introduces electrically conductive adhesives and inks that are custom-designed for wearable electronics. Some of these products include the 125-19FS, the 120-07, and the 124-33. The 125-19FS is a conductive ink that is…read more

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Nutella used as a Thermal Paste

February 20th, 2015

On February 5, which was World Nutella Day, Cool Master celebrated the hazelnut-chocolate spread by using Nutella as a thermal paste. The firm heated the Nutella first and cleaned the CPU before applying the spread.…read more

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UV-cured Adhesive Increases Reliability in Assembly of Electronics

February 9th, 2015

Engineered Materials Systems, Inc. introduces a new UV cure adhesive, the 535-11M-3. The 535-11M-3 is a non-conductive, low-outgassing, flexible adhesive that eliminates “crowning” of sliders in Head Gimbal Assemblies. This flexible and strong adhesive does not contain antimony…read more

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Thermally Stable and Optically Clear Epoxy Introduced

February 9th, 2015

Master Bond Inc. introduces its EP62-1LPSP, an optically clear and low viscosity epoxy which features a long open time at room temperature. This epoxy bonds well to many substrates such as composites, metals, glass and…read more

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New Epoxy Offers Low Coefficient of Thermal Expansion

January 12th, 2015

Master Bond announces its EP42HT-2LTE, a two part room temperature curing epoxy. This epoxy is ideal for use in bonding, sealing, coating and casting applications in the aerospace, electronic, optical and specialty OEM industries. The…read more

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Research Group at U-Michigan Develops Heat-conducting Plastic

December 16th, 2014

A research team from the University of Michigan has developed a heat-conducting plastic that bends 10 times better than previous materials. Plastic is a favorable material for electronic devices because it is lightweight, flexible and…read more

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Experiments Demonstrate Graphene is 10 times Stronger than Steel

December 9th, 2014

A research group from Rice University and the University of Massachusetts have discovered that graphene, one of the strongest materials in the world, is 10 times stronger than steel and can stop a speeding bullet.…read more

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