Materials, Compounds, Adhesives, Substrates

New Materials Technology Brochure Released

July 1st, 2015

Thermacore, Inc. released a new materials technology brochure which offers information about the company’s Materials Technology Division (MTD) including material development and processing capabilities. Some of the capabilities, products and services discussed in the brochure include…read more

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Graphene Doubles Charging Capacity of Lithium-ion Batteries

June 30th, 2015

Researchers from the Samsung Advanced Institute of Technology have discovered how to double the charging capacity of lithium-ion batteries. By coating the silicone anodes in lithium-ion batteries with graphene, the charging capacity nearly doubles. The…read more

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New Fast Curing Silicone Designed for High Performance Bonding

June 29th, 2015

Master Bond Inc. announces the MasterSil 912Med, a new one-part, neutral curing silicone designed for high performance bonding, coating and sealing for medical devices. It easily adheres to materials including ceramics, composites, glass, metals, rubbers,…read more

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Discovered Material May Reduce Heat Buildup in Computer Chips

June 23rd, 2015

Researchers conducting x-ray studies at the U.S. Department of Energy’s SLAC National Accelerator Laboratory have observed a possible solution for reducing heat buildup in computer chips for the first time. The team observed “an exotic…read more

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Researchers Successfully Measure Thermoelectric Behavior for the First Time

June 9th, 2015

A team from Sandia National Laboratories has made the first measurement of thermoelectric behavior via nanoporous metal-organic framework (MOF). This discovery could produce a new class of materials in the future that would improve upon…read more

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Silicone-based Sponge Connectors Unveiled

June 8th, 2015

Fujipoly America Corporation introduces new self-supporting sponge connectors. These connectors are ideal for connecting LCD panels to circuit boards. “Each connector is made from an economical and highly reliable Zebra core that is sandwiched between…read more

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New Technology Improves Heat Dissipation Performance

May 26th, 2015

OKI Circuit Technology in Japan has developed a mass-production technology for multi-layer copper-coin printed circuit boards that supports high speeds and high frequencies. The technology is a T-Coin (Technology of copper coin insert) structure that…read more

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New Gap Filler Improves Heat Management in Automotive Electronics

May 20th, 2015

Dow Corning introduces the TC-4525, a thermally conductive gap filler that offers advanced heat management in automotive electronics. This gap filler is two-part silicone, soft, compressible and cost-effective. It can be used directly from its…read more

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New Hot Melt Adhesive Offers Instant Green Strength

May 11th, 2015

Dow Corning announces a new hot melt room-temperature vulcanization (RTV) black adhesive, the EA-4600. It’s a one-component, moisture-cure and solventless silicon material, designed to improve assembly of consumer electronics and other devices such as smart…read more

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UPenn Physicists Discover New Material that May Cool Computers

May 5th, 2015

Heat emitted from computers, laptops and other electronic devices during use is regularly caused by numerous transistors overcrowded in the devices. This also expels large amounts of wasted heat energy. A pair of physicists from…read more

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Trio of Companies to Improve Graphite Thermal Management Products

April 27th, 2015

Three Canadian companies, Terrella Energy Systems, Alpha Technologies, and Westport Innovations, have partnered up to improve low-cost graphite thermal management products. The companies have partnered with researchers at Simon Fraser University and Ontario’s Sheridan College…read more

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Thermal Foil Sheets Offer Advanced Thermal Management in Smartphones

April 13th, 2015

Angstron Materials Inc. has developed a family of thermal foil products ideal for smartphones, and other hand-held devices. The new thermal foil sheets have a thickness of from 5 um to 40 um and thermal…read more

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Temporary Bonding Adhesive for 3D Wafer Integration

April 6th, 2015

AI Technology Inc. introduces its new 3D TSV ultra thin wafer processing adhesive (WPA) for thin wafer processing. The new adhesives are thermally stable to 320-330 degrees Celsius and have high bond strength. “In comparison…read more

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New Conductive Adhesives and Inks Announced

March 9th, 2015

Creative Materials, Inc. introduces electrically conductive adhesives and inks that are custom-designed for wearable electronics. Some of these products include the 125-19FS, the 120-07, and the 124-33. The 125-19FS is a conductive ink that is…read more

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