Materials, Compounds, Adhesives, Substrates

Surface Temperatures of Electronics Products: Appliances vs. Wearables

September 20th, 2016

by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Prior to designing the requisite thermal management solution, engineers routinely calculate the junction temperatures of active and passive components using various methods at…read more

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High-Performance Circuit Materials Exhibited at Upcoming Conference

September 6th, 2016

Rogers Corporation will exhibit its high-performance circuit materials at the PCB West 2016 Conference and Exhibition, booth 201. Designed to dissipate heat in high-power applications, thermally enhanced 92ML laminates and prepregs are halogen-free, flame-retardant, thermally…read more

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Book Review of Electronics Cooling (2016)

September 6th, 2016

by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving…read more

New Epoxy Ideal for High Vacuum Environments

August 30th, 2016

Master Bond has released their new two part epoxy, EP30AN-1. EP30AN-1 is ideal for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity and NASA low outgassing approval. It offers superb dimensional…read more

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Thermal Conductivity & CTE of Materials: Can We Engineer Them?

August 30th, 2016

by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Most electronics cooling problems are not just limited to the computation of temperatures at various points and the design remedies thereof. They also…read more

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Tech Brief: Commercially-available Thermally Enhanced Polymer Composite Materials Characteristics

August 22nd, 2016

Peter Rodgers, Editor Valérie Eveloy, The Petroleum Institute Introduction The development, characterization, and implementation of polymer composite materials for the thermal management of electronic equipment has recently began to attract attention [1,2].  The enhanced thermal conductivity,…read more

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Temporary Bonding Adhesive for Thin Wafer Handling Introduced

August 15th, 2016

AI Technology has developed specialized tools and equipment to handle thin wafers and thin reconstituted wafers. A series of temporary bonding materials can process temperatures up to 150 Cº, and are well accepted for grinding,…read more

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Thermal Conductor Research Project Joined by UH Physicist

August 2nd, 2016

(July 21, 2016) University of Houston’s MD Anderson Professor and physicist, Zhifeng Ren, has joined the $7.5 million collaboration to develop a material with a higher conductivity than diamonds. “Earlier research conducted in this field…read more

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Combination of Two Insulators Could Enable More Efficient Heat Management

August 2nd, 2016

(July 28, 2016) Recently, “researchers at the University of Utah and the University of Minnesota have discovered that when two oxide compounds—strontium titanate (STO) and neodymium titanate (NTO)—are joined together, they make an extraordinary conductive…read more

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Heat Sinks Improved with 3D Printing

August 2nd, 2016

(July 18, 2016) The complimenting research done by Oak Ridge National Laboratory and the University of Tennessee Knoxville has found a way to improve the heat dissipation in electronics using 3D printing. According to 3DPrint.com,…read more

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New Material Allows Quantum Computing without Overheating

July 26th, 2016

(July 21, 2016) Recently, with the use of some everyday materials, researchers discovered a breakthrough that would allow quantum computing at room temperature. “A long conduction electron spin lifetime in metallic-like material made up of…read more

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Cooling Powerful Electronics with Powerful Sand

July 19th, 2016

(July 13, 2016) Recently, associate professor Baratunde Cola of the Woodruff School of Mechanical Engineering at the Georgia Institute of Technology uncovered the “potential of silicon dioxide nanoparticles coated with a high dielectric constant polymer…read more

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Application of Phase Change Materials in Handheld Computing Devices

July 7th, 2016

William Maltz, Darryl Moore, and Arun Raghupathy 1. Introduction With peak loads often in the order of minutes and ergonomic considerations limiting surface temperatures and acoustical noise, handheld devices, such as smart phones or tablets, are…read more

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Thermal Expansion Discovery Could Lead to More Durable Electronics

June 28th, 2016

(June 27, 2016) Standford professor of materials science and engineering, Reinhold Dauskardt, and doctoral candidate Joseph Burg, recently released a study revealing that the layers protecting transistors in chips respond differently to compression and tension…read more

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