Graphite mining and exploration company Focus Graphite Inc. has announced a joint venture development agreement on behalf of Grafoid Inc. with CapTherm Systems Inc., a developer of cooling technologies for high-power electronics, to develop and…read more
Joint Venture for Development of “Next Generation” EV and LED Thermal Management Systems Announced
April 19th, 2013
Scientists Answer Mystery Regarding How Bi2Te3 and GaAs Are Combined, Opening Door for More Efficient Cooling Technologies
March 25th, 2013
While researchers have long known that thin films of bismuth telluride (Bi2Te3)—which converts heat into electricity or electricity into cooling—can be combined on top of a gallium arsenide (GaAs) foundation to create cooling devices for…read more
Thermally Conductive Acrylic Interface Pads Provide ‘Excellent Conformability’ and ‘Compressive Stress Relaxation’
March 19th, 2013
Rathbun Associates, a provider of 3M thermal, VHB and EMI solutions, has released 3M thermally conductive acrylic interface pads, high-performance non-silicone-based thermal pads for use in non-silicone applications. According to the company, the new acrylic…read more
Heat Transfer at ‘Any Temperature’ Makes Thermal Interface Film Suitable for Cold Plate Applications
March 19th, 2013
Thermal interface material developer AOS Thermal Compounds recently released Micro-Faze, a thermal interface film formulated with non-silicon thermal grease. According to AOS Thermal Compounds, Micro-Faze “requires minimum force to achieve total interface contact” and “Retains…read more
Low-Viscosity Thermally Conductive Silicone Compound
March 15th, 2013
Fujipoly introduces its SARCON SPG-20A, a low-viscosity thermally conductive silicone compound. When applied between a heat-generating component and a nearby heat sink or spreader, the very low compression, form-in-place material fills gaps up to .50…read more
New Metal Oxide-Silicone Thermal Compound Offers Thermal Conductivity of 7.5W/mK
March 11th, 2013
German power supplies manufacturer Be Quiet! Has released DC1, a new high performance thermal compound for critical cooling applications. According to the company, the new electrically non-conductive, metal oxide-silicone thermal compound features a “very high…read more
New Silicone-Based Material May Increase Computer Speeds without Increasing Energy Consumption, Heat
February 25th, 2013
Scientists from Dow Corning Electronic and IBM have developed a new high-performance, silicone-based material that could replace copper in waveguides and enable supercomputers to use energy more efficiently while simultaneously allowing for an increase computing…read more
New Type of Heat-Conducting Paste “Optimized” for Thermal Management of Power Semiconductors
February 25th, 2013
Infineon Technologies AG and Henkel Electronic Materials have collaborated to release a new type of heat-conducting paste “optimized” for thermal management of power semiconductors. According to the two companies, the new compound allows a higher…read more
New Magnetic Cooling Technology Decreases Environmental Impact of Cooling, Avoids Side Effects of Magnetic Fields on Electronics
February 22nd, 2013
Researchers from the University of Cambridge, U.K. and CIC nanoGUNE in Spain have developed a new cooling technology for the thermal management of computer chips and other miniaturized devices that utilizes materials that change their…read more
Thermal Gap Fillers Feature High Performance, Low Contact Resistance
February 11th, 2013
Laird Technologies, Inc., a designer of customized performance-critical components and systems for advanced electronics and wireless products, has announced the release of Tflex SF800 and Tflex SF200, two new Tflex series thermal gap fillers. According…read more
Researchers Enhance Thermoelectric Device Efficiency with Embedded Nanoparticles
February 7th, 2013
Researchers at the Massachusetts Institute of Technology (MIT) and Rutgers University have developed a new method of enhancing the efficiency of thermoelectric devices using embedded nanoparticles, structures created by embedding one material into another. The…read more
New Silicone Potting and Encapsulating Compound for Rapid Thermal Transfer
November 21st, 2012
Epoxies, Etc., a manufacturer of thermal management compounds, epoxies and adhesives, has released a new silicone potting and encapsulating compound. According to the company, the 50-1952 is formulated for rapid thermal transfer away from heat-generating…read more
Nanotechnology Copper-Based Solder Material for Applications in Military and Commercial Systems
November 12th, 2012
Scientists at the Lockheed Martin Space Systems Advanced Technology Center (ATC) in Palo Alto, California have developed CuantumFuse, a nanotechnology copper-based electrical interconnect material for applications in aerospace, military and commercial systems. According to the…read more
New Porous Metal Technology for Thermal Management in Electronic Components
November 12th, 2012
U.K. startup Versarien will provide a demonstration of porous metal technology and its potential uses in thermal management products during the Electronica exhibition in Munich, Germany this week. The startup was created after CEO Neil…read more
Recent Posts
- New Business Development Specialist Seeks Position
- ‘Advanced Composite Thermal Management Materials and Applications’ Webinar to Take Place
- Preventing Thermal & Vibration Failures in Electronic Equipment
- Thermoreflectance Thermal Imaging System for Quality Control and Reliability Analysis
- Software Suite Handles Massive Data Flows Generated by Thermal Sensors
- Nanolaser Technology Room-Temperature Breakthrough Could Facilitate Faster Computer Operation
- Nanoscale Heat Transfer Research Awarded Air Force Grant
- Thermal Characterization Tools for Testing and Evaluation of TIM Materials
Latest Issue
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the March 2013 issue
of Electronics Cooling, which includes feature articles on the Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, and more.
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