Materials, Compounds, Adhesives, Substrates

Thermal Expansion Discovery Could Lead to More Durable Electronics

June 28th, 2016

(June 27, 2016) Standford professor of materials science and engineering, Reinhold Dauskardt, and doctoral candidate Joseph Burg, recently released a study revealing that the layers protecting transistors in chips respond differently to compression and tension…read more

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Special Adhesives to Better Medical Equipment

June 21st, 2016

(June 13, 2016) Device manufacturers are making more accurate, compact medical equipment with electronics technology. MedicalPlasticsNews.com reported that they are using “pressure-sensitive adhesives (PSAs)” which were “developed as a heat sink attachment method to eliminate…read more

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A Cooler Microchip Design with a Black Semiconductor

June 13th, 2016

(June 12, 2016) Researchers and scientists at the University of California-Berkeley have found that layered, crystalline black phosphorus could “lead to a new microchip design that lets heat flow away and keeps electrons moving,” said…read more

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Controlling the Heating and Cooling in Graphene

June 13th, 2016

(May 17, 2016) “Researchers from University of Groningen and the University of Manchester have now, for the first time, directly detected the Peltier effect in graphene that is either one or two atoms thick [and]…read more

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High Temperature Analogue and Mixed Signal Electronics May Become Silicon Carbide-Based

May 31st, 2016

(May 24, 2016) Recently, SiC (Silicon carbide) has been recognized as a material that can be “used for small signal electronics – such as analogue and mixed-signal devices – making possible the locating of monitoring…read more

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New Method for Doping Single Crystals of Diamond Discovered

May 31st, 2016

(May 24, 2016) Researchers at the University of Wisconsin-Madison have recently introduced a new method for doping to bring diamonds a step further as semiconductors. Doping is a “process in which other elements are integrated…read more

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Researchers May Have Solved the Problem of Thermal Resistance for ICs

May 23rd, 2016

(May 18, 2016) Researchers at Lockheed Martin are further exploring the idea of microspraying hot integrated circuits (ICs) to cool their thermal resistance problem. EETimes.com reported, “The efforts are focused on gallium-nitride (GaN) power amplifiers…read more

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New Type of Graphene Could Increase Processor Clock Speeds

May 23rd, 2016

(May 19, 2016) Recently, scientists from the Moscow Institute of Physics and Technology (MIPT), the Institute of Physics and Technology RAS, and Tohoku University (Japan), have developed a new type of graphene-based transistor, whose modeling…read more

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Self-Healable Electronic Material That Can Help Prevent Overheating

May 17th, 2016

(May 16, 2016) A new, more durable electronic material has recently been created to repair itself and heal all its functionality even after breaking several times. Phys.org detailed, “Self-healable materials are those that, after withstanding…read more

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Laptops May Start Producing Far Less Heat

May 17th, 2016

(May 10, 2016) Massachusetts Institute of Technology’s postdoc Cui-Zu Chang and his colleagues have been “working to create devices with components which have little [to no] resistance to the flow of electricity” in laptops, according…read more

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New Availability of Data Matrix Codes (DMCs)

May 9th, 2016

Rogers has announced that they can add data matrix codes (DMCs) to a wide range of metalized substrates, including direct-bonded-copper and active-metal-brazed substrates. The codes can be “text or numeric in form and encoded by…read more

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New Material Cools Solar Cells Yet Absorbs Sunlight

May 9th, 2016

Recently, researchers from Stanford University have achieved a combination of cooling and maintaining sunlight absorption with a wafer made of silica to better cool solar cells, according to BusinessWire.com. BusinessWire.com explained, “The researchers etched tapered…read more

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Graphene Nanoflakes Better Dissipates Electronics’ Heat

May 2nd, 2016

(April 29, 2016) Recently, a team of researchers from Chalmers University of Technology in Sweden have developed a more efficient approach to cooling electronics using graphene nanoflake-based film. According to E&T, the team performed “experiments…read more

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Potential Electronics Cooling Application of Carbon Nanotubes

April 25th, 2016

(April 21st, 2016) A technique has been found that could allow carbon nanotubes to be used in electronic cooling and as devices in microchips, sensors and circuits in the future. Phys.org reported that the technique…read more

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