Materials, Compounds, Adhesives, Substrates

New Epoxy Offers Low Coefficient of Thermal Expansion

January 12th, 2015

Master Bond announces its EP42HT-2LTE, a two part room temperature curing epoxy. This epoxy is ideal for use in bonding, sealing, coating and casting applications in the aerospace, electronic, optical and specialty OEM industries. The…read more

Research Group at U-Michigan Develops Heat-conducting Plastic

December 16th, 2014

A research team from the University of Michigan has developed a heat-conducting plastic that bends 10 times better than previous materials. Plastic is a favorable material for electronic devices because it is lightweight, flexible and…read more

Experiments Demonstrate Graphene is 10 times Stronger than Steel

December 9th, 2014

A research group from Rice University and the University of Massachusetts have discovered that graphene, one of the strongest materials in the world, is 10 times stronger than steel and can stop a speeding bullet.…read more

Company offers Thermoplastic Compounds Solutions

December 9th, 2014

There is a reported global shortage of Polyetherimide (PEI) and RTP Company offers a solution with its thermoplastic compounds as a practical alternative to the polymer. Engineers from RTP Company have produced and modified these…read more

Company Introduces Low Outgassing Epoxy

November 24th, 2014

The Master Bond EP17HT-LO has just been introduced by Master Bond Inc. This product is a low outgassing “one part epoxy for bonding, sealing, coating and encapsulation applications.” This epoxy is capable of operating in…read more

Scientists Produce Beneficial Materials for Optoelectronics

November 24th, 2014

Last month, scientists announced Molybdenum Disulfide MoS2 as a new successor to graphene and better material due to its low electrical resistance, high thermal conductivity and its ability to be stretched. Scientists have just introduced…read more

Graphene Coatings Increase Thermal Conductivity of Plastics

November 10th, 2014

A group of researchers and engineers have discovered that by adding a graphene coating to materials, the thermal conductivity of the materials increases by 600 times. In the group’s experiment, a common plastic called PET,…read more

Lab Safety Improved with Quick Disconnect Couplings on Caps

November 10th, 2014

Colder Products Company introduces its BQ45GL series – 45mm caps with integrated quick disconnect couplings, which is a first in the market. “Adding quick disconnects to media bottles enhances the user experience when using laboratory…read more

Dissolvable Materials Look Toward ‘Greener’ Future

October 28th, 2014

A research group, lead by John A. Rogers, at the University of Illinois at Urbana-Champaign, has produced dissolvable circuits and sensors. These devices are made from silicon and can dissolve completely when immersed in water…read more

Gasoline and Diesel Fueled Vehicles and Instruments See Increased Fuel Efficiency in Near Future

October 27th, 2014

A new thermoelectric material to increase fuel efficiency has been introduced by GMZ Energy. The material is called Hafnium-free p-type half-Heusler and costs less to produce than previous materials. This material also has an improved…read more

Carbon Nanotubes Prove to Be Beneficial Semiconductors

October 10th, 2014

A group of researchers from the University of Texas at Austin and Northwestern University have discovered that carbon nanotubes, a semiconductor material, improve performance and reliability of transistors and circuits. These nanotubes are a better…read more

New EP21AOLV-2Med Epoxy Proves Successful and Desirable

September 22nd, 2014

Masterbond Inc. has just introduced its New Epoxy named EP21AOLV-2Med which has passed all USP Class VI Tests and ISO 10993-5 Specifications. “EP21AOLV-2Med is thermally conductive and electrically isolating with a smooth consistency and good…read more

New Series of Bonding Wax Created to Shrink Wafers in Electronic Devices

September 22nd, 2014

AI Technology, Inc. has just announced its new temporary bonding wax – which was developed with intentions to shrink the thickness of wafers and dies in electronic devices such as cell phones, tablets, cameras, etc.…read more

Expansion of Company’s Line of Conductive Compounds Expected to Increase Consistency

September 22nd, 2014

RTP company, a company that produces custom thermoplastics, has just announced its new conductive compounds. The expansion of its previous line of conductive compounds is intended to progress levels of consistency in conductivity and mechanical…read more