Materials, Compounds, Adhesives, Substrates

Atom Cooling Technique Discovered

August 25th, 2015

A team of researchers from the University of Southampton have successfully used matter waves to cool molecules that cannot be handled by typical laser methods. This is the first demonstration of this technique, which was…read more

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New Adhesives Ideal for Bonding and Encapsulating Semiconductors

August 24th, 2015

DELO introduces new one-component epoxy resins that can withstand temperatures up to 250 degrees Celsius. These new anhydride-based adhesives are ideal for bonding and encapsulating sensors and semiconductors, according to the company. The adhesives were…read more

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Electronic Devices Made Faster by Graphene Nanoribbon Technique

August 17th, 2015

Graphene could be used for the next generation of faster, more energy-efficient electronics. According to engineers from the University of Wisconsin-Madison, they have developed “a way to grow graphene nanoribbons with desirable semiconducting properties directly…read more

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Penn State Engineers Developed New Heat-Resistant Polymer

August 11th, 2015

A group of Penn State engineers have produced lightweight, flexible dielectric polymers that are heat resistant and easily manufactured. Because of its resistance to heat, the new polymer is ideal for use in power electronics…read more

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3D Shapes Formed from Flat Sheets of Graphene Paves way for Flexible Electronics

July 28th, 2015

A team from the University of Illinois at Urbana-Champaign has developed a new method for forming 3D shapes from flat 2D sheets of graphene. This development will pave the way for flexible electronics and integrated…read more

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High Performance Epoxy Passes ASTM E595 Testing For NASA Specifications

July 27th, 2015

Master Bond introduces a two-part, NASA approved, low outgassing, high temperature resistant epoxy known as the EP121CL-LO. “This two component system has a low mixed viscosity of 1,000-3,000 cps with a mix ratio of 100:80…read more

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Colored Electrically Conductive Inks and Coatings

July 20th, 2015

Creative Materials, Inc. introduces the 126-29 product series of electrically conductive inks and coatings. The inks and coatings are available in red, blue or yellow. “Colored conductive inks feature good color stability and minimal opportunity…read more

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New Heat Transfer Tapes Offer Advanced Thermal Management

July 14th, 2015

Techsil introduces two new thermally conductive and pressure sensitive adhesive tapes for thermal management of electronic systems, the Stokvis 202331 and 202332. The tapes are double sided and provide efficient cooling solutions by dissipating heat…read more

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Nanowires Showcase Unusual ‘Anelastic’ Properties

July 14th, 2015

Researchers from Brown University and North Carolina State University have discovered that nanowires made of semiconductor materials have pronounced anelasticity. This means that when the wires are bent, they slowly revert back to their original…read more

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Distribution of Carbon Nanotubes in Composite Materials Mapped

July 6th, 2015

Researchers from the National institute of Standards and Technology (NIST), the Massachusetts Institute of Technology and the University of Maryland have collected techniques to map the nanoscale structure of carbon nanotubes inside a composite material…read more

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New Materials Technology Brochure Released

July 1st, 2015

Thermacore, Inc. released a new materials technology brochure which offers information about the company’s Materials Technology Division (MTD) including material development and processing capabilities. Some of the capabilities, products and services discussed in the brochure include…read more

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Graphene Doubles Charging Capacity of Lithium-ion Batteries

June 30th, 2015

Researchers from the Samsung Advanced Institute of Technology have discovered how to double the charging capacity of lithium-ion batteries. By coating the silicone anodes in lithium-ion batteries with graphene, the charging capacity nearly doubles. The…read more

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New Fast Curing Silicone Designed for High Performance Bonding

June 29th, 2015

Master Bond Inc. announces the MasterSil 912Med, a new one-part, neutral curing silicone designed for high performance bonding, coating and sealing for medical devices. It easily adheres to materials including ceramics, composites, glass, metals, rubbers,…read more

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Discovered Material May Reduce Heat Buildup in Computer Chips

June 23rd, 2015

Researchers conducting x-ray studies at the U.S. Department of Energy’s SLAC National Accelerator Laboratory have observed a possible solution for reducing heat buildup in computer chips for the first time. The team observed “an exotic…read more

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