Materials, Compounds, Adhesives, Substrates

3D Shapes Formed from Flat Sheets of Graphene Paves way for Flexible Electronics

July 28th, 2015

A team from the University of Illinois at Urbana-Champaign has developed a new method for forming 3D shapes from flat 2D sheets of graphene. This development will pave the way for flexible electronics and integrated…read more

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High Performance Epoxy Passes ASTM E595 Testing For NASA Specifications

July 27th, 2015

Master Bond introduces a two-part, NASA approved, low outgassing, high temperature resistant epoxy known as the EP121CL-LO. “This two component system has a low mixed viscosity of 1,000-3,000 cps with a mix ratio of 100:80…read more

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Colored Electrically Conductive Inks and Coatings

July 20th, 2015

Creative Materials, Inc. introduces the 126-29 product series of electrically conductive inks and coatings. The inks and coatings are available in red, blue or yellow. “Colored conductive inks feature good color stability and minimal opportunity…read more

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New Heat Transfer Tapes Offer Advanced Thermal Management

July 14th, 2015

Techsil introduces two new thermally conductive and pressure sensitive adhesive tapes for thermal management of electronic systems, the Stokvis 202331 and 202332. The tapes are double sided and provide efficient cooling solutions by dissipating heat…read more

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Nanowires Showcase Unusual ‘Anelastic’ Properties

July 14th, 2015

Researchers from Brown University and North Carolina State University have discovered that nanowires made of semiconductor materials have pronounced anelasticity. This means that when the wires are bent, they slowly revert back to their original…read more

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Distribution of Carbon Nanotubes in Composite Materials Mapped

July 6th, 2015

Researchers from the National institute of Standards and Technology (NIST), the Massachusetts Institute of Technology and the University of Maryland have collected techniques to map the nanoscale structure of carbon nanotubes inside a composite material…read more

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New Materials Technology Brochure Released

July 1st, 2015

Thermacore, Inc. released a new materials technology brochure which offers information about the company’s Materials Technology Division (MTD) including material development and processing capabilities. Some of the capabilities, products and services discussed in the brochure include…read more

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Graphene Doubles Charging Capacity of Lithium-ion Batteries

June 30th, 2015

Researchers from the Samsung Advanced Institute of Technology have discovered how to double the charging capacity of lithium-ion batteries. By coating the silicone anodes in lithium-ion batteries with graphene, the charging capacity nearly doubles. The…read more

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New Fast Curing Silicone Designed for High Performance Bonding

June 29th, 2015

Master Bond Inc. announces the MasterSil 912Med, a new one-part, neutral curing silicone designed for high performance bonding, coating and sealing for medical devices. It easily adheres to materials including ceramics, composites, glass, metals, rubbers,…read more

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Discovered Material May Reduce Heat Buildup in Computer Chips

June 23rd, 2015

Researchers conducting x-ray studies at the U.S. Department of Energy’s SLAC National Accelerator Laboratory have observed a possible solution for reducing heat buildup in computer chips for the first time. The team observed “an exotic…read more

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Researchers Successfully Measure Thermoelectric Behavior for the First Time

June 9th, 2015

A team from Sandia National Laboratories has made the first measurement of thermoelectric behavior via nanoporous metal-organic framework (MOF). This discovery could produce a new class of materials in the future that would improve upon…read more

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Silicone-based Sponge Connectors Unveiled

June 8th, 2015

Fujipoly America Corporation introduces new self-supporting sponge connectors. These connectors are ideal for connecting LCD panels to circuit boards. “Each connector is made from an economical and highly reliable Zebra core that is sandwiched between…read more

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New Technology Improves Heat Dissipation Performance

May 26th, 2015

OKI Circuit Technology in Japan has developed a mass-production technology for multi-layer copper-coin printed circuit boards that supports high speeds and high frequencies. The technology is a T-Coin (Technology of copper coin insert) structure that…read more

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New Gap Filler Improves Heat Management in Automotive Electronics

May 20th, 2015

Dow Corning introduces the TC-4525, a thermally conductive gap filler that offers advanced heat management in automotive electronics. This gap filler is two-part silicone, soft, compressible and cost-effective. It can be used directly from its…read more

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