Materials, Compounds, Adhesives, Substrates

Researchers May Have Solved the Problem of Thermal Resistance for ICs

May 23rd, 2016

(May 18, 2016) Researchers at Lockheed Martin are further exploring the idea of microspraying hot integrated circuits (ICs) to cool their thermal resistance problem. EETimes.com reported, “The efforts are focused on gallium-nitride (GaN) power amplifiers…read more

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New Type of Graphene Could Increase Processor Clock Speeds

May 23rd, 2016

(May 19, 2016) Recently, scientists from the Moscow Institute of Physics and Technology (MIPT), the Institute of Physics and Technology RAS, and Tohoku University (Japan), have developed a new type of graphene-based transistor, whose modeling…read more

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Self-Healable Electronic Material That Can Help Prevent Overheating

May 17th, 2016

(May 16, 2016) A new, more durable electronic material has recently been created to repair itself and heal all its functionality even after breaking several times. Phys.org detailed, “Self-healable materials are those that, after withstanding…read more

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Laptops May Start Producing Far Less Heat

May 17th, 2016

(May 10, 2016) Massachusetts Institute of Technology’s postdoc Cui-Zu Chang and his colleagues have been “working to create devices with components which have little [to no] resistance to the flow of electricity” in laptops, according…read more

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New Availability of Data Matrix Codes (DMCs)

May 9th, 2016

Rogers has announced that they can add data matrix codes (DMCs) to a wide range of metalized substrates, including direct-bonded-copper and active-metal-brazed substrates. The codes can be “text or numeric in form and encoded by…read more

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New Material Cools Solar Cells Yet Absorbs Sunlight

May 9th, 2016

Recently, researchers from Stanford University have achieved a combination of cooling and maintaining sunlight absorption with a wafer made of silica to better cool solar cells, according to BusinessWire.com. BusinessWire.com explained, “The researchers etched tapered…read more

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Graphene Nanoflakes Better Dissipates Electronics’ Heat

May 2nd, 2016

(April 29, 2016) Recently, a team of researchers from Chalmers University of Technology in Sweden have developed a more efficient approach to cooling electronics using graphene nanoflake-based film. According to E&T, the team performed “experiments…read more

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Potential Electronics Cooling Application of Carbon Nanotubes

April 25th, 2016

(April 21st, 2016) A technique has been found that could allow carbon nanotubes to be used in electronic cooling and as devices in microchips, sensors and circuits in the future. Phys.org reported that the technique…read more

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Thermal Innovations Win Award and Industry Recognition

April 25th, 2016

(April 19th, 2016) Henkel’s Adhesive Technologies recently won two NPI Awards presented at last month’s APEX event in Las Vegas, as reported by EMCNow.com. According to EMCNow.com, Henkel had its third consecutive win in the…read more

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New “Form-In-Place” Product with Process Demonstration Video

April 22nd, 2016

JONES TECH recently released their newest “Form-In-Place” Product with a video that demonstrates their FIP process. Their thermal product offerings include thermal pads, thermal greases, thermal gels, phase change materials, and synthetic graphite. Jones Tech…read more

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iNEMI ROADMAP IDENTIFIES TRENDS IMPACTING ELECTRONICS THERMAL MANAGEMENT

April 14th, 2016

iNEMI ROADMAP IDENTIFIES TRENDS IMPACTING ELECTRONICS THERMAL MANAGEMENT   PREFACE The International Electronics Manufacturing Initiative (iNEMI) is an industry-led consortium of approximately 100 leading electronics manufacturers, suppliers, associations, government agencies and universities. One of iNEMI’s…read more

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Electrocaloric Polymers That Create On-Demand Cooling

April 11th, 2016

A team of researchers from Pennsylvania State University have recently developed a blend of ferroelectric polymers that could cool chips and small scale systems on demand. According to NewElectronics these are called electrocaloric materials, and…read more

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Formula Developed for Heat Transfer Between Near-Field Bodies

April 11th, 2016

Alejandro Rodriguez, a researcher at Princeton, and colleagues at the Massachusetts Institute of Technology have come up with a formula that describes the maximum heat transfer between near-field objects in a recent study. Phys.org claimed…read more

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New Power Electronics Will Allow Army Vehicles’ Electronics to Operate at High Temperatures

April 4th, 2016

The US Army has awarded GE Aviation with a contract to develop silicon carbide-based power electronics that will allow high-voltage, next-generation ground vehicles to operate at higher temperatures. “The US Army’s implementation of [this technology…read more

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