Data Centers

Second Deployment of Liquid Cooling Solution Scheduled for Supercomputing Center

November 16th, 2015

Recently, CoolIT Systems announced it is delivering a second deployment of its Rack DCLC™ data center liquid cooling solution to the Poznan Supercomputing & Networking Center. “The PSNC cluster expansion combines Huawei blade servers in…read more

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Immersion Cooling in Bitcoin Mining Data Centers

November 9th, 2015

Power densities in bitcoin mining data centers are radically higher than in data centers that house traditional IT equipment. Some data centers have found that by bringing bitcoin mining ASICs, or Application Specific Integrated Circuits,…read more

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Company CEO Asks “Is Free Cooling Really Free?” At Conference

September 22nd, 2015

CEO of LiquidCooling Solutions, Inc., Herb Zien, is serving on a panel until Thursday, Sept. 24, at the North America’s Emerging Green Conference in Portland, Oregon. On Wednesday Sept. 23, from 1:30 – 3:00 p.m.,…read more

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Cooling Matters

September 16th, 2015

AIR FORCE INQUIRES ABOUT THERMAL MGMT.SOLUTIONS FOR FUTURE AIRCRAFT 8/11/15 – The U.S. Air Force is looking into new thermal management techniques to cool the electronics in future fighter aircraft. “Officials of the Air Force Research…read more

On-site Cogeneration for Reducing Data Center Primary Energy Use

September 15th, 2015

Dustin W. Demetriou, PhD Email: dwdemetr@us.ibm.com As most readers are aware, the data center industry has put an increased focus on energy efficiency and environmental impact. Data centers in the United States are estimated to…read more

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Two Phase Cooling System for Data Centers

September 8th, 2015

Ebullient introduces a two phase cooling system for data centers – the Ebullient Cooling System (ECS). It can cool up to 12 heat sources in series in a continuous loop while maintaining a device temperature…read more

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New Material to Decrease Energy Usage in Electronics

August 4th, 2015

Researchers have determined that gallium nitride (GaN) could become the next best semiconductor for electronics because it would immensely cut energy usage. Cambridge Electronics Inc. (CEI) has announced a new line of GaN transistors and…read more

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California Energy Code Updated; New Regulations for Cooling Data Centers

July 28th, 2015

The California Energy Code, also known Title 24 of the CA Code of Regulations – part 6, has been revised. The new revision implements new regulations for cooling data centers and server rooms in order…read more

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New Fan Offers Industry Leading Static Pressure

July 27th, 2015

Sanyo Denki introduces the San Ace 172 9HV type ø 172 x 150 x 51 mm high static pressure fan. The San Ace 172 9HV type offers industry leading static pressure, or 1.6 times the…read more

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Reducing Reliance on Water for Cooling in Data Centers

June 9th, 2015

The severe drought in California has spiked concerns about the availability of water to operate data centers. Since water is extremely important for cooling facilities, other approaches of water usage in data centers reportedly need…read more

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Largest Data Center in Asia to be Completed in July 2015

June 2nd, 2015

LG U+, a telecommunications company in Gyeonggi, South Korea, announced its mega data center will be completed in Pyeongchon in July 2015. When completed, it will be the largest data center in Asia and the…read more

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Doctoral Candidate’s Research Could Improve Efficiency of Data Centers

May 26th, 2015

Husam Alissa, a Binghamton University doctoral candidate in mechanical engineering, has been working to improve the efficiency of data centers at the university’s Center for Energy-Smart Electronic Systems (ES2). Alissa’s work focuses on reducing overheating,…read more

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Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense – Extended Article

May 26th, 2015

Dr. Alexander Yatskov Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center…read more

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Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense

May 21st, 2015

By: Dr. Alexander Yatskov; Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data…read more

Posted in Articles, Coolers, Data Centers, Design, Enclosures, Heat Exchanger, Heat Pipes | Comments Off on Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense