Strategic investment in Emerald AI bridges gap between AI compute demand and grid constraints through IT/OT convergence Fluence Energy Inc. (Fluence) energy storage solutions are designed to accelerate grid connection and enable faster data center deployment PhysicsX collaboration introduces AI-accelerated modeling for data center power infrastructure, enabling faster … [Read more...]
Signal SHFWT Series Delivers Superior Efficiency, Thermal Performance and Low EMI noise in High-Frequency Toroidal Inductor
Signal has announced the introduction of its SHFWT Series Helical Wound Flat Wire Toroidal Inductors, broadening the Signal portfolio with a high-performance solution for demanding electronic designs. The SHFWT Series strengthens Signal’s lineup of chokes, coils, and inductors, responding to increasing demand for efficient, low-loss, high-frequency power components. The low … [Read more...]
JetCool Collaborates with Broadcom to Deliver Innovative Liquid Cooling for Next-Generation AI XPUs
JetCool, a Flex company and a leading provider of end-to-end liquid cooling solutions for high-density compute, today announced it has collaborated with Broadcom to deliver liquid cooling for next-generation AI XPUs, backed by Flex's global mass production capabilities. As AI training and inference workloads accelerate, silicon power densities are advancing into sustained … [Read more...]
Johnson Controls to Acquire Alloy Enterprises
Johnson Controls, a global technology leader in energy efficiency, decarbonization, thermal management and mission-critical performance, has signed an agreement to acquire Alloy Enterprises, a Boston-based company specializing in a next-generation thermal management platform for high-performance data centers and other mission critical industrial applications. The move will … [Read more...]
Highlights From the 19th ASME InterPACK Conference
The 2025 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2025) was held from October 28–30, 2025, at the Hotel Fera Anaheim, a DoubleTree by Hilton, in Anaheim, California. Hosted by the ASME Electronic and Photonic Packaging Division (EPPD), the conference served as a premier forum for advancing … [Read more...]
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