Editorial Note The following transcript is adapted from a presentation delivered by Henkel at Thermal Live Fall 2025. It is shared here to provide readers with access to the technical discussion in written form. For the complete presentation experience, including slides and audience Q&A, the full session is available to watch on demand. Introduction In this … [Read more...]
Data Center Cooling Options
Modern data centers require advanced cooling solutions to operate at peak performance. As one of the most rapidly growing industries in the world, data centers are changing how we develop new cooling technology at a record pace. The data center market is projected to continue growing by 8.5% per year over the next five years, to over $600 billion by 2029.* Artificial … [Read more...]
Condenser Array Design for High-Density Data Centers
Introduction In recent years, the power density of server racks has surged past 100 kW/rack [1] to support compute-intensive workloads such as artificial intelligence and data analytics. Cooling systems play an increasingly important role in enabling such densification improvements and in improving overall data center energy consumption, equipment reliability, and total cost … [Read more...]
Rethinking Thermal Design Priorities in Electronics Packaging
Steady state operating temperature is a critical design parameter for ensuring the reliable operation of modern electronics systems. However, in practice it is but one of many factors that impact overall system health and performance. Modern challenges, like the large transient power draw associated with artificial intelligence (AI) workloads create the potential for more … [Read more...]
Sheetak Solves Micro-Scale Hotspots with New µCENTUM™ Thermoelectric Coolers
High-power cooling in a sub-1.6mm profile provides critical thermal stability for high-density electronics. AUSTIN, TX - To solve the growing challenge of localized hotspots in high-density electronics, Sheetak Inc. has launched its µCENTUM™ series of micro-thermoelectric coolers (TECs). These compact solid-state devices deliver powerful, component-level cooling to uphold … [Read more...]
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