Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
Don’t miss out on the March 2013 issue of Electronics Cooling, which includes the 2013 Buyers’ Guide, feature articles on Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, Measuring and Predicting Junction Temperature: Thermal Factors Influencing Reliability in GaN HEMTs, as well as technical briefs.
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Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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