Thermal interface material developer AOS Thermal Compounds recently released Micro-Faze, a thermal interface film formulated with non-silicon thermal grease. According to AOS Thermal Compounds, Micro-Faze “requires minimum force to achieve total interface contact” and “Retains all the performance advantages of thermal grease . . . in the form of a thermal pad.” Suited for cold … [Read more...]
Archives for March 2013
SEMI-THERM Draws Thermal Engineers; View Our Photos
SEMI-THERM takes place this week in San Jose, Calif. Below are photos taken by Electronics Cooling staff. Photos, from top, include: Electronics Cooling editors Jim Wilson and Bruce Guenin pose with the latest issue of Electronics Cooling. Business Manager Casey Goodwin chats with a visitor at the Electronics Cooling booth. A view of the exhibit hall. The … [Read more...]
SEMI-THERM Presents Executive Briefing
This year, SEMI-THERM has introduced the Executive Briefing: Thermal Management Market Visions & Strategies conference in conjunction with the SEMI-THERM annual symposium. Aimed at bringing technology and technical leaders, C-Level executives and engineering, product development and business managers together, the executive briefing program will focus on current market … [Read more...]
Low-Viscosity Thermally Conductive Silicone Compound
Fujipoly introduces its SARCON SPG-20A, a low-viscosity thermally conductive silicone compound. When applied between a heat-generating component and a nearby heat sink or spreader, the very low compression, form-in-place material fills gaps up to .50 mm in height. According to the company, "The form stable thermal compound requires no heat curing, will not cause corrosion on … [Read more...]
General Purpose Thermoreflectance Analyzer Released
Microsanj announces a new product to premiere at SEMI-THERM. The latest addition to the Thermoreflectance Thermal Imaging product line is the NT100A General Purpose Thermoreflectance Analyzer. The analyzers include the NT100: General Purpose; NT200/210: 100nsec, submicron transient; NT300/310: Through-the-substrate (flip mount); and NT410: 800psec high performace. Visit … [Read more...]
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