Researchers from the University of Rochester in New York have proposed a “new type of nanoscale engine” that recycles heat emitted from a device and uses it to power the same device. According to Andrew Jordan, a theoretical physics professor at the University of Rochester, the new nanoscale engine would use quantum dots—manufactured systems that act as “artificial atoms” … [Read more...]
Archives for March 2013
Laptop Computer Smothered by Clothing Identified as Cause of House Fire
Officials have identified a laptop computer that was left running while sitting on top of a pile of clothes as the cause of a fire that destroyed a house in St. Raphael, Prince Edward Island, Canada earlier this week. "We believe that that laptop, at some point, got warm, and that heat then built up on that pile of clothes, and at some point ignited those clothes and that's … [Read more...]
“Golf Ball Dimple” Cooling Fans Added to Distribution Portfolio
Luso Electronics, a distributor of thermal management products, has announced the addition of Zaward Corporation’s patented “Golf Fan” products for thermal management in computing and industrial applications. According to Luso Electronics, the design for the new fans is based on “the dimpled surface of a golf ball” and “shows improved airflow and low noise at the same rotating … [Read more...]
New Liquid Cooling System Cools Submerged Electronics without Frying Them
Dr. John Summers demonstrates the Icetope liquid cooling system by submerging an iPhone in the 3M Novec solution. (Video: University of Leeds) Researchers at the University of Leeds in the United Kingdom have developed a cooling method that they claim reduces energy consumption for cooling by 80 to 97 percent by immersing server components in an electrically non-conductive … [Read more...]
Electronics Cooling 2013 Buyers’ Guide Issue Now Online
Don’t miss out on the March 2013 issue of Electronics Cooling, which includes the 2013 Buyers’ Guide, feature articles on Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, Measuring and Predicting Junction Temperature: Thermal Factors Influencing Reliability in GaN HEMTs, … [Read more...]
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