INTRODUCTION Over the last 10 years, there has been a well-documented increase in the energy density of electronic devices. As this energy density has gone up, so has the heat dissipation on electronics packages. In response to this challenge, significant research has taken place to develop chip level cooling systems to meet heat fluxes in excess of 1000W/cm2. As stated … [Read more...]
SEMI-THERM 30 Media
Photos Videos Colder Products Company Discusses New Products at SEMI-THERM 30. The Bergquist Company Discusses Products at SEMI-THERM 30. … [Read more...]
Relationship between Supply Flow Rate of Small Cooling Fans and Narrow Flow Passages in High-Density Packaging Electronic Equipment
Takashi Fukue and Koichi Hirose Dept. of Mech. Eng., Iwate University Tomoyuki Hatakeyama and Masaru Ishizuka Dept. of Mech. Syst. Eng., Toyama Prefectural University Katsuhiro Koizumi Cosel Co., Ltd. Introduction Forced convection driven by cooling fans is widely used for removing heat from electronic equipment. A net cooling performance of the cooling fans is … [Read more...]
Cooling Fans for 1U Rack Applications
Thermal management product designer US Tech has released three new high performance fan series for use in 1U rack applications. The 36mm model produces 24.16 CFM of air volume and 67.52 mm-H2O pressure. In addition, its adherence to the 1U spec of 1.75” (44.45mm) outside to outside tall will leave enough height to design a FRU (Field Replaceable Unit) if desired. The 38mm and … [Read more...]
Apple Files Patent for Smaller, Quieter Wireless Cooling Fan
A patent application filed by Apple hints at the company’s latest plan to bypass design limitations and shrink their devices even more. While the technology company strives to develop increasingly lighter and thinner products, certain components limit how thin and light the company can make their devices. One such component is the cooling fan, an essential thermal management … [Read more...]
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