Thermal characterization plays a vital role in electronic package reliability testing, design, and verification of manufacturing processes. The reliability of electronic packages is controlled, in part, by ensuring the maximum junction temperature is not exceeded during operation. Systems such as cell phones, electric vehicles and computers, must operate with die temperatures … [Read more...]
A Non-Contact Measurement Method for Thin Vapor Chambers by Photonic Technologies
Introduction In recent years, integrated circuit chips have enabled increasingly powerful computing capabilities as advanced process nodes have moved from DUV (deep ultra-violet) to EUV (extreme ultra-violet) lithography, allowing for higher fabrication resolution and transistor density. Additionally, advanced multi-die packaging has seen increased market demand. As a … [Read more...]
Liquid Cooling Takes Center Stage at OpenCompute Summit 2024
OCP Global Summit started this week in San Jose and as to be expected, two topics are getting all the attention –AI Compute and Liquid Cooling. Apart from these two, co-packaged optics (CPO) is another topic that has garnered much interest this year at the summit. As for liquid cooling, the market adoption has been primarily in using facility water via coolant distribution … [Read more...]
Thermocouple Transient Behavior
Previous articles in this series described how thermocouple wire size [1] and thermocouple attachment method [2] can affect steady state temperature measurements. This article briefly discusses how these factors can affect the transient response of thermocouples when used to monitor temperatures that change value over time. Bare Thermocouple Junction Before addressing … [Read more...]
Tech Brief: Radiation Basics: When Does It Matter?
Introduction This is the first installment in a series of articles that aim to explore a range of practical topics on radiation that will be relevant to those of us focused on electronics cooling and thermal design. While radiation is one of the three fundamental modes of heat transfer, it is often the last topic covered in an introductory heat transfer course. This may … [Read more...]
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