Jeff Hershberger, Robert Smythe, Xiaoyi Gu and Richard F. Hill Laird Technologies, Inc. INTRODUCTION Thermoelectric cooling is an active thermal management technique. A thermoelectric cooler (TEC) has two circuit boards which are typically Al2O3 plates with copper circuit traces attached to them and semiconductor elements soldered between them. TECs are now available … [Read more...]
High Power Thermoelectric Cold Plate for 19-Inch Racks
Elite Thermal Engineering, a developer of high power, high performance thermoelectric cooling devices, has released a 19-inch version of its thermoelectric cooling plate OCP-300 and high power heat sink HS-004 created for use with 19-inch rack systems in both OEM and laboratory applications. The new model numbers are OCP-300L and HS-004L, respectively. Measuring 15 in. long x … [Read more...]
Non-Silicone Thermal Pad Offers Natural Tack, Good Insulation
Tglobal Technology Co., Ltd. has released its new PC94 non-silicone thermally conductive pad. Ideal for electronic component, heat sink, LED and other thermal applications, the new soft pad features an acryl base, natural tack and good insulation with a thermal conductivity of 4 W/m-K, working temperature of -40°C to 105°C and tensile strength of 2 Kgf/mm2. … [Read more...]
Use of JEDEC Thermal Metrics in Calculating Chip Temperatures in Packages with Attached Heat Sinks
Bruce Guenin Associate Technical Editor, Electronics Cooling INTRODUCTION The previous column, "Use of JEDEC Thermal Metrics in Calculating Chip Temperatures (without Attached Heat Sinks)" dealt with the application of JEDEC thermal metrics to IC packages that do not have heat sinks attached to them [1]. The methods are applicable to prediction of the junction … [Read more...]
Heat Sink Series Provides Modular Cooling Options for Electrical Components
Ohmite Manufacturing, a provider of thermal solutions and resistors, has released its new B60/C60 heat sink system ideal for use with high power density and small size (3U or 4U) electronic packaging with forced convection. The new B60/C60 heat sink system provides designers with a variety of cooling options for up to six TO-246 or TO-264 devices, such as TO-247 and TO-264 … [Read more...]
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