CTS Corporation has announced the release of new fansinks for high temperature applications. Designed to absorb and disperse heat away from high temperature devices, the FHS series features an operating temperature range of -10°C to 90°C, calculated MTTF @ 90°C: 86,858 hours (GEM, 90% confidence) and various package sizes to fit different applications. The FHS series is … [Read more...]
Carbon Nanotubes Boost Microprocessor Cooling
Researchers from the U.S. Department of Energy have developed a new technique that combines carbon nanotubes and organic materials to enable more efficient cooling of microprocessor chips. While carbon nanotubes have long been known to offer high thermal conductivity, widespread application in cooling systems has proven difficult because of their high thermal interface … [Read more...]
Hybrid Liquid-Air-Cooled Heat Sink for Extreme Environments
CoolClouds, Inc. has announced the availability of a new class of heat sinks for use in high performance computers or extreme environments starting mid-Q1 2014. According to the company, SuprCool-PC is the first “in-chassis” heat sink to cool more than 300w in the latest Intel and AMD processors without hot spots at 65°C case temperature in 25°C ambient. Comparable in size to … [Read more...]
Thermal Facts & Fairy Tales: How Useful Are Heat Sink Correlations for Design Purposes?
Clemens J.M. Lasance Guest Editor, Philips Research Emeritus, Consultant at SomelikeitCool I assume everybody agrees with the fact that it is pointless to devote precious space in this magazine to highlight again all problems related to thermal management of electronic products and systems, so let’s start right away. An important way of reducing the temperature in an optimal … [Read more...]
Patent for Heat Spreader for IC Package, and IC Package Clamper Having the Heat Spreader
The U.S Patent and Trademark Office has awarded patent No. 8, 587,947, “Heat Spreader for IC Package, and IC Package Clamper Having the Heat Spreader” to Shinko Electric Industries Co., Ltd. of Japan. According to background information supplied by the inventors, “there are proposed various heat spreaders for spreading heat generated from an IC chip mounted on an IC … [Read more...]
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