TDK-EPC, a group company of TDK Corporation, has developed snap-in aluminum electrolytic capacitors from EPCOS that enable optimal contact to heat sinks. This permits link circuit capacitors to be efficiently cooled, significantly increasing their ripple current capability and operating life. As a result, the new capacitors are especially suited for applications in frequency … [Read more...]
Heat Pipe-Assisted Heat Sinks for Power Electronics Cooling
Advanced Cooling Technologies Inc. (ACT) in Lancaster, Pa., is introducing the heat-pipe-assisted HiK Plate heat sinks for power electronics cooling applications involving insulated gate bipolar transistors (IGBTs), thyristers, intelligent power modules (IPMs), symmetric gate commutated turn-off thyristors (SGCTs), and silicon controlled rectifiers (SCRs). Power electronic … [Read more...]
ElectronicsCooling Winter 2010 Issue
Don’t miss out on the Winter 2010 issue of ElectronicsCooling, which includes a sneak peek at SEMI-THERM 27, feature articles on open bath immersion cooling, and energy consumption of data centers, as well as technical briefs. If you would like to receive your free copy of ElectronicsCooling click here to subscribe. Read the Winter 2010 issue here. … [Read more...]
Calculation Corner: Thermal Interactions Between High-Power Packages and Heat Sinks, Part 1
Bruce Guenin, PhD Associate Technical Editor The need to accommodate increasing chip power has led to improved package and heat sink designs having much lower thermal resistance values than previously. This has led to challenges in accurately calculating the thermal performance of the package and heat sink as an integral unit on the basis of thermal resistance measurements … [Read more...]
Thermal Facts and Fairy Tales: Fixed Temperature and Infinite Heatsinking
In keeping with the name of this column, the fact worth reminding is that a fixed temperature boundary condition in a thermal simulation represents an infinite heat sink. The systems that thermal engineers model and simulate have boundaries and thus require some type of specification, usually known as boundary conditions. Related to the other part of the name of this column, … [Read more...]
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