Thermacore’s Therma-Base vapor chamber is used as the base of a heat sink to alleviate spreading resistance found in solid heat sink construction, which enables lower device temperature and greater component reliability. The chamber features effective thermal conductivity over 5,000 W/mK; application improvement of over 30% in high-flux, poor spreading applications; and over … [Read more...]
Thermal Grease Screen Printers
Surface Mount Techniques (SMT) announces stencil/screen printers specifically designed for thermal grease applications. Highly concentrated heat sources found in ever shrinking electronic designs have increased the demand for better heat dissipation. The demand is seen across many industries: power electronics, electric vehicles (EV), ever shrinking handheld devices and … [Read more...]
Thermal Gap Fillers Combine High Performance, Low Pricing
New TP-S30 thermal interface pads from MH&W International provide 3.0 W/mK of thermal conductivity between hot components and heat sinks at lower costs than competing gap filler materials. Pads of TP-S30 thermal gap fillers are soft and compliant for easy compression and filling of air gaps between mounting surfaces to optimize heat transfer. Applications for these gap … [Read more...]
Heat Sinks Contribute to Cool Silence
Silent-cooled graphics cards are becoming increasingly prevalent as PC hardware is becoming increasingly efficient. In silent cooling, a heat sink is installed in a model that engineers determine can remain safely cool without a fan. The heat sink pulls heat build up away from the graphics processor on the card, but since there are no moving parts involved in this cooling … [Read more...]
ElectronicsCooling Summer 2010 Print Issue
Don't miss out on the Summer 2010 issue of ElectronicsCooling, which includes feature articles on thermal design in silicon validation platforms, motor supports and small scale fans, and solar photovoltaic cell thermal measurements. If you would like to receive your free copy of ElectronicsCooling click here to subscribe. Read the Summer 2010 issue here. … [Read more...]
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