Korea Institute of Machinery & Materials is first to develop a TGP that operates in any direction, improving cooling efficiency by modifying the surface of a porous structure. During the past decade, developments in semiconductor industries have allowed electronics such as sensors and actuators to be miniaturized so as to perform effectively in a limited space. As a … [Read more...]
TC350 Plus Laminates for Higher Microwave & Industrial Heating Applications
Rogers Corp. has introduced TC350 Plus laminates. TC350 Plus laminates are ceramic filled PTFE-based woven glass reinforced composite materials providing a cost effective, high performance, thermally enhanced material for the circuit designer. With a thermal conductivity of 1.24W/mK, this next generation PTFE-based laminate is ideally suited for higher power microwave and … [Read more...]
New Diafilm TM220 from Element Six Offers Thermal Conductivity in Excess of 2200W/mK
At the 2019 International Microwave Symposium (IMS) Element Six, part of the De Beers Group, launched a new diamond thermal material grade designated Diafilm TM220. Said to be the world’s first diamond thermal material engineered to offer industrial users thermal conductivity in excess of 2200 W/mK, Diafilm TM220 was developed in response to the increasing demand for more … [Read more...]
Thermal Gap Filler Reduces Stress on Sensitive Components
Laird Performance Materials has introduced the Tflex HD80000, a high deflection thermal gap filler combining 6 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination allows minimal stress on sensitive components within a device while also yielding low thermal resistance. As a result, less mechanical and thermal stresses are … [Read more...]
Managing Cooling Fan Noise In Product Design
ABSTRACT Cooling fan noise is a system property determined as much by thermal and mechanical design and fan selection as by a fan’s acoustical design. While even the quietest fan can be used in a noisy manner, a significant fraction of unpleasant surprises can be avoided. NOMENCLATURE C Numerical constant D … [Read more...]
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