Did you miss us? For those of you that are faithful readers of Electronics Cooling, we are pleased to inform you that after a short interval of restructuring, we have resumed publication. Given the recent downturn in the economy as a whole, and specifically within the electronics thermal management community, we can hope that this is a sign of improvement and recovery. We will … [Read more...]
electronics cooling in the automotive environment
Introduction By 2008 the electronics content of a typical consumer vehicle had grown to 20-25% of the total vehicle cost [1]. This content provides a wide range of functions and features for today’s driver. Some features such as the radio/audio system and instrument cluster are quite familiar and visible to the driver and have been mainstays in the automobile for many years. … [Read more...]
LED Thermal Standardization: A Hot Topic
Introduction The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and LED-based products (see Fig.1 showing a typical LED package). The LED-business is growing much faster than analysts predicted five years ago. Unfortunately, the progress in thermal characterization has not kept … [Read more...]
Health Assessment and Prognostics of Electronic Products: An Alternative to Traditional Reliability Prediction Methods
Introduction Traditional handbook-based reliability prediction methods for electronic products include Mil-Hdbk-217, Telcordia SR-332 (formerly Bellcore), PRISM, FIDES, CNET/RDF (European), and the Chinese GJB-299. These methods rely on analysis of failure data collected from the field and assume that the components of a system have inherent constant failure rates that are … [Read more...]
Numerical Simulation of Complex Submicron Devices
Introduction Significant increases in temperature are believed to contribute to losses in reliability and performance, and can present serious complications to thermal management. The net thermal effect depends on a combination of factors related to the feature size, power densities, and material properties. In semiconductor devices, higher heat flux densities can result from … [Read more...]
