As wireless devices increase in complexity, the challenges around maintaining temperature control continue to mount. As smartphones, for example, require more and more transistors to fit into smaller spaces, there’s simply not as much space for the heat to dissipate. Wireless designers are tasked with finding new ways to keep these devices from overheating without … [Read more...]
Underfill Epoxy Offers Thermal Conductivity and Electrical Insulation
Product: EP29LPTCHT Release Date: 11/21/2019 Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications. It does not need excessive heat for curing and has a long working life at room temperature. This system is electrically insulative and thermally conductive with very fine particle … [Read more...]
Hammond Adds 36 Configurations to its IP68 1554 and 1555 Industry 4.0 Families
To protect electronics in an industrial environment, Hammond Manufacturing has added 36 new configurations to its Industry 4.0 1554 and 1555 sealed enclosure families. Available in ABS or polycarbonate with styled, opaque, clear or smoked lids, the six new sizes are 4.13 x 4.13 x 2.36 and 3.54 inches (105 x 105 x 60 and 90mm), 5.51 x 5.51 x 2.36 and 3.54 inches (140 x 140 x 60 … [Read more...]
Molex QSFP-DD BiPass Module Cooler Helps Designers on the Path to 112 Gbps PAM-4
As industry prepares for the launch of next-generation copper and optical QSFP-DD transceivers, thermal management strategies are critical. The new Molex QSFP-DD thermal solution can cool a range of 15W to 20W in different configurations with a 15 degree Celsius change from ambient temperature. In data centers and telecommunication infrastructure, 56 and 112 Gbps … [Read more...]
Managing Cooling Fan Noise In Product Design
ABSTRACT Cooling fan noise is a system property determined as much by thermal and mechanical design and fan selection as by a fan’s acoustical design. While even the quietest fan can be used in a noisy manner, a significant fraction of unpleasant surprises can be avoided. NOMENCLATURE C Numerical constant D … [Read more...]
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