Control of cooling fans has become increasingly popular as efforts are made to reduce system power consumption and mechanical fan noise. The purpose of including a fan is to reduce temperature and keep it as low as possible. Mean time to failure for a variety of systems increases rapidly as temperature elevates. This has brought about a wide choice of thermally based fan … [Read more...]
Electronic Information Exchange
Electronic data exchange represents a very important link for integrating PCB electrical layout, analysis and mechanical design. It has become, in fact, the basis for enhanced economic and industrial growth. The Intermediate Data Format (IDF) is the most used file format for exchanging printed circuit assembly (PCA) data between electrical and mechanical CAD/CAE systems and for … [Read more...]
Numerical Modeling and Experimental Verification of High-density Servers
High-density hardware and software are developed as part of an initiative to greatly increase data center compute densities. Concept systems presented here are based on the Intel® Itanium™ processor family and are designed for a 1U rack-mount form factor. The current dual-processor system concept is targeted at the front-end server market (e.g., web hosting and mail routing), … [Read more...]
The Challenge of Operating Computers at Ultra-low Temperatures
Although the potential for low temperature enhancement of CMOS circuit performance has been recognized for some time, circuit scaling (proportionally reducing the size of the circuit) has been the preferred method of achieving higher performance. But as minimum feature size passed well into the sub-micron and now into the nanometer region, this route to higher performance has … [Read more...]
Determining the junction temperature in a semiconductor package, part IV – localized heat generation on the die
In the standard thermal test environment, thermal test chips are designed to dissipate the applied power uniformly over most of the die surface. However, in many situations of practical interest, the power is dissipated over a localized area of the die. This column provides calculation methods to deal with the latter situation. Figure 1 illustrates the situation of interest … [Read more...]
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