Researchers at the University of Arkansas have developed integrated circuits capable of surviving at temperatures greater than 350 degrees Celsius, or approximately 660 degrees Fahrenheit. Created using silicon carbide, a semiconducting material that is more rugged than conventional materials used in electronics, the new circuits are expected to improve the operation of analog … [Read more...]
Controlling Thermal Conductivity to Improve Energy Storage
Researchers at the University of Illinois at Urbana-Champaign have experimentally shown for the first time that the thermal conductivity of lithium cobalt oxide (LixCoO2), a material used in the cathodes of lithium-ion batteries, can be reversibly electrochemically modulated over a significant range. Many technologies require control over the flow of heat through materials in … [Read more...]
Solder Joint Lifetime of Rapidly Cycled LED Components
Wendy Luiten Philips Research, Eindhoven, the Netherlands INTRODUCTION Active LEDs in a consumer TV product are boosted and dimmed with the video picture content. Boosting and dimming of the LEDs is a powerful means to improve visual experience, either through application of active LEDs in an ambient light feature, or through dimming and boosting of the display LEDs in a … [Read more...]
New Plastic Helps Prevent Phones from Overheating
A new plastic material could significantly reduce problems associated with overheating mobile phones, say researchers from Loughborough University in England. Known as ultra-high molecular-weight polyethylene (UHMWPE), the new plastic, unlike the ones currently used in mobile phone covers, dissipates the heat created by the lithium batteries and reduces the likelihood of … [Read more...]
Advances in Vapor Compression Electronics Cooling
INTRODUCTION Over the last 10 years, there has been a well-documented increase in the energy density of electronic devices. As this energy density has gone up, so has the heat dissipation on electronics packages. In response to this challenge, significant research has taken place to develop chip level cooling systems to meet heat fluxes in excess of 1000W/cm2. As stated … [Read more...]
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