As electronic devices have grown smaller and more powerful, new thermal management methods have been created to help prevent them from overheating; however, researchers and engineers are in a constant race to come up with new methods to adequately manage the increasing amount of heat being generated by shrinking next-generation devices. Now, scientists at University of … [Read more...]
Hybrid Liquid-Air-Cooled Heat Sink for Extreme Environments
CoolClouds, Inc. has announced the availability of a new class of heat sinks for use in high performance computers or extreme environments starting mid-Q1 2014. According to the company, SuprCool-PC is the first “in-chassis” heat sink to cool more than 300w in the latest Intel and AMD processors without hot spots at 65°C case temperature in 25°C ambient. Comparable in size to … [Read more...]
Technique Combines Heat Sinks for More Effective Cooling
Researchers at the National University of Singapore have developed a new two-phase technique they say is up to 50 percent more effective in cooling electronic systems compared to current cooling technology. Led by Lee Poh Seng, Ph.D., of the Department of Mechanical Engineering at NUS, the team combined microgap and stepped fin microchannel heat sinks to create a two-phase … [Read more...]
Connectors for Liquid Cooling Applications
Colder Products Company, a provider of quick disconnect couplings and fittings for plastic tubing, has released the new LQ6 series connectors. Designed specifically for liquid cooling applications requiring multiple connect and disconnect cycles, these specialized couplings deliver reliability, security and ease-of-use in cooling applications where a drip-free connection is … [Read more...]
Flexible Thermal Absorbing Films Boost Heat Dissipation in Small Electronics
Manufacturing company Henkel has released Loctite TAF, a new thermal absorbing film designed to address the heat management challenges associated with small but high-functioning handheld electronic devices. “Managing the intense heat generated by today’s handheld products is one of the biggest challenges facing device designers today,” Jonathan Rowntree, vice president of … [Read more...]
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