Laird Technologies has announced a new series of miniature thermoelectric modules for applications where temperature stabilization of sensitive optical components in photonics, telecom, medical and consumer markets is critical. Built using Laird Tlam thermally conductive circuit boards instead of traditional ceramic-based circuit boards, the new TIam OptoTEC series improves the … [Read more...]
Heating Up Nanodevices May Keep Electronics Cool
As electronic devices have grown smaller and more powerful, new thermal management methods have been created to help prevent them from overheating; however, researchers and engineers are in a constant race to come up with new methods to adequately manage the increasing amount of heat being generated by shrinking next-generation devices. Now, scientists at University of … [Read more...]
Air-Inlet Grill Reduces Axial and Centrifugal Fan Noise
Fan and blower manufacturer ebm-papst has released FlowGrid, a patent-pending air-inlet grill designed to reduce noise levels for fans installed within limited-space air-moving equipment. “FlowGrid is the result of our extensive airflow testing for inlet conditions with a wide variety of customers’ axial and centrifugal fans across dozens of applications,” George Riker, … [Read more...]
Thermal Management of Many-Core Processors Using Power Multiplexing
Man Prakash Gupta and Satish Kumar G.W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology INTRODUCTION Due to the growing demands of higher performance and faster computing, the number of cores in a microprocessor chip has been increasing consistently. The transition from single core to multi-core technology has already been observed in the past few … [Read more...]
Use of JEDEC Thermal Metrics in Calculating Chip Temperatures (without Attached Heat Sinks)
Bruce Guenin Assoc. Technical Editor, Electronics Cooling INTRODUCTION JEDEC single-chip package thermal metrics are widely used as a means of characterizing the thermal performance of semiconductor packages. They correlate the peak temperature of a uniformly-heated semiconductor chip (the junction temperature, TJ) with the temperature of a specified region along the heat … [Read more...]
- « Previous Page
- 1
- …
- 31
- 32
- 33
- 34
- 35
- …
- 43
- Next Page »
