Carbodeon, a supplier of superhard materials such as nano-diamonds and graphitic carbon nitride, has released a new thermally-conductive nanodiamond filler it claims increases the conductivity of thermally-conductive polymers by 25 percent. According to the company, the increase in thermal conductivity is achieved without affecting the electrical insulation or other mechanical … [Read more...]
Thermal Connectors Improve PCB Assembly Heat Dissipation
TEM Products Inc., a manufacturer of mechanical components for electro-mechanical assembly, has released its new patent-pending PowerPeg thermal connectors. Designed for attachment to an external dissipater, the new PowerPeg thermal connectors offer significantly improved thermal conductivity compared to traditional PCB heat spreading methods by allowing heat to dissipate more … [Read more...]
Temperature Controller for Demanding Electro-Optical Applications
AMS Technologies has released its new pulse width modulated (PWM) temperature controller for demanding electro-optical applications. Suited for applications requiring high efficiency, low power dissipation and high stability, the WTCP5V5A Temperature Controller delivers all the advantages of PWM control in a PCB-mounted package, the company said. The WTCP5V5A can operate from … [Read more...]
New Low-Thermal Resistance Gap Filler Pad
Fujipoly has released new Sarcon GR25A-0H2-30GY, a 0.3mm thick, low thermal resistance interface material with a low-tac surface on both sides. According to the company, the material’s new formulation dramatically reduces material tearing and damage during assembly and rework operations and improves cooling performance by filling unwanted air gaps between board components and … [Read more...]
Wind Tunnel for Thermal and Airflow Testing of Multiple PCBs
Omega Engineering has released the new WT-3200 series of wind tunnels for thermal and airflow testing of multiple PCBs. Featuring a 2-D converging nozzle with a multi-point measurement area for sensor placement upstream of the test section, the test chamber can accommodate up to six PCBs with 13 mm (0.5 in) card-to-card spacing or three PCBs with 25 mm (1 in) card-to-card … [Read more...]
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