Wavelength Electronics’ PLD-CH Series is now available in a 12.5 A model. This new driver supports fiber-coupled lasers used in applications such as medical, dental, micro-machining, material processing, semiconductor inspection, and imaging. The PLD-CH Series offers single-supply low voltage operation from +5 V DC, which minimizes heat dissipation. For applications that … [Read more...]
Data Centers Play Key Role in Transferring Medical Information
The issue of building new data centers and retrofitting or expansion of older ones to handle more sophisticated and increased amounts of medical data has become more critical as the Obama administration has announced that $975 million in grants will help states, doctors and hospitals move from paper to electronic record-keeping. Continuous power supply and proper cooling … [Read more...]
Health Assessment and Prognostics of Electronic Products: An Alternative to Traditional Reliability Prediction Methods
Introduction Traditional handbook-based reliability prediction methods for electronic products include Mil-Hdbk-217, Telcordia SR-332 (formerly Bellcore), PRISM, FIDES, CNET/RDF (European), and the Chinese GJB-299. These methods rely on analysis of failure data collected from the field and assume that the components of a system have inherent constant failure rates that are … [Read more...]
LED Thermal Standardization: A Hot Topic
Introduction The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and LED-based products (see Fig.1 showing a typical LED package). The LED-business is growing much faster than analysts predicted five years ago. Unfortunately, the progress in thermal characterization has not kept … [Read more...]
Numerical Simulation of Complex Submicron Devices
Introduction Significant increases in temperature are believed to contribute to losses in reliability and performance, and can present serious complications to thermal management. The net thermal effect depends on a combination of factors related to the feature size, power densities, and material properties. In semiconductor devices, higher heat flux densities can result from … [Read more...]
