Laird has released its new air-to-air outdoor cooler, the AA-480 Series, that is smaller and more energy efficient than similar units on the market. The cooler has “480 Watts of cooling power and a Coefficient of Performance (COP) rating of 1, and an operating temperature range of -40°C to +55°C,” according to the company, “It has been designed to pass Telcordia test … [Read more...]
New Particle Creates Less Heat, Saves Energy
Researchers have discovered a new particle that doesn’t consume a lot of energy, and thus doesn’t require an elaborate cooling system. It is called the Weyl fermion, a particle that only exists inside materials and “moves through materials practically without resistance,” according to Nanowerk.com. In contrast to today’s computer chips relying on “electrons which are always … [Read more...]
New Refrigerant-Based Rack and Row Cooling Solution for IT Equipment
Rittal Corporation has recently introduced a new refrigerant-based rack and row cooling solution, LCP DX, for heat removal of critical IT components. The Rittal Rack LCP DX “puts the cooling only where needed to protect valuable IT equipment while minimizing energy costs” and “includes air-flow optimized enclosures with includes baffles and blanking panels,” said the … [Read more...]
Overcoming Cooling Challenges Downloadable Webinar Now Available
The recent Electronics Cooling with Autodesk CFD Webinar on how to ensure proper cooling as the electronics used in products change and improve is now available for download. Exploring ‘invisible elements’ like airflow and heat transfer, speaker Jim Byrne talks through how to maximize product performance by overcoming common electronics challenges like reduction in product … [Read more...]
Registration for Thermal Conference Opens
ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and engineering exploration of thermal, thermo-mechanical and emerging technology issues associated with electronic devices, packages, and systems. According to the … [Read more...]
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